Semi Backend Process

Resonac’s Magnetic Molding Compound is designed to mold inductor coils in power circuits, etc.

Resonac’s solder resist materials protect and insulate the circuit surface of flexible substrates with fine-pitch wiring.

Resonac’s silicone-free insulation coating materials protect the connections of display peripheral circuits and prevent electrode corrosion caused by moisture absorption, thereby contributing to higher device reliability.

Resonac’s non-UV-type adhesive tape has been used to secure parts during the dicing process of manufacturing semiconductors, electronic devices and optical components. The product has been used for over 40 years in various applications, including the processing of silicon, ceramics and chip LEDs.

Resonac’s Cleaning Sheet for encapsulation molding dies of semiconductor packages. By placing the sheet between dies and heating it, stains are transferred to the sheet and removed.

Resonac’s mold release films suppress the burring of epoxy molding compounds and provide excellent mold release during the transfer molding process.

Resonac’s adhesive tapes are designed to prevent the leakage of resins attached to the backside of lead frames when map molding quad flat non-leaded (QFN) packages.

Resonac’s coating material increases adhesion between the surface of semiconductor chips or lead frames and epoxy molding compounds. Contributing to higher reliability of power modules, including automotive models, with its excellent thermal resistance and insulation capability, the product has been marketed for over 30 years.

Resonac’s liquid encapsulant fills the gap between chip and substrate and protects solder bumps and substrates of Flip Chip Package. The product enjoys a large market share worldwide.

Resonac’s epoxy molding compounds is suitable for semiconductor packages assembled with organic substrates such as BGA and CSP.

Resonac’s epoxy molding compounds seal and protect the areas around the chips of semiconductor packages assembled with various metal lead frames.

Resonac’s die attach films (DAF) combine function of dicing tapes and die bonding films suitable for semiconductor wafer singulation and bonding process.

Resonac’s solvent-free die bonding paste (conductive and non-conductive types) bonds chips to leadframes and organic substrates when manufacturing semiconductor packages.

Resonac’s photosensitive resin materials are designed to form the insulation parts of redistribution layers (RDL) in semiconductor packages.

Resonac’s masking tape with excellent chemical resistance makes stripe plating easier, protecting areas not to be plated on various lead frame strips.​

Resonac’s adhesive protection D Series film used for the drawing process of stainless plates also provides greater convenience in deep drawing of sinks or bathtubs.​

Resonac’s adhesive surface protection film offers a wide range of uses, from colored steel sheets, metal plates such as stainless steel or aluminum, resin plates including acrylic and polycarbonate, to nameplates with printed plastic films. Marketed for over 50 years, Resonac’s protective film has earned a reputation for its high reliability in the industry.​

Resonac’s White Epoxy Molding Compound has been adopted to LED package reflectors of major LED makers.

Resonac’s ACF for solderless connections connects components with fine-pitch circuits, such as image sensors, to substrates with low-temperature thermo-compression bonding instead of solder.

Resonac’s ACF for IC chips easily connects display panels and fine-pitch terminals, including driver ICs, with thermo-compression bonding.

Resonac’s ACF connects film substrates, such as FPC and COF, to display panels.

Resonac’s thermal conductive sheets (TIM material) with electrical conductivity efficiently release heat from IC chips when applied a semiconductor package, and between IC chip and a heat spreader, heatsink or heat pipe.