News Releases
2023
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2023.09.15
Business
Resonac Announces Termination of HD Media Business in Taiwan
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2023.09.14
Sustainability
Resonac Introduces Value Creation Story Starting from Its Purpose under the Key Concept “Here We Go”
-Resonac Publishes RESONAC REPORT 2023, the Group’s First Integrated Report- -
2023.08.08
Management / IR
Consolidated Financial Statements for the first half year (Jan. 1 to Jun. 30, 2023)
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2023.08.08
Management / IR
Consolidated Financial Results, Second Quarter, 2023 (Presentation Material)
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2023.08.08
Management / IR
Resonac Announces Difference between Performance Forecast and Results
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2023.08.03
Business
Resonac’s Oita Complex Acquires ISCC PLUS certification
-Resonac takes a step toward carbon neutrality by introducing biomass material into its ethylene plant- - 2023.07.26 Business Japan Patent Office Decides to Maintain Validity of Resonac’s Four Patents on Anode Materials for Lithium-ion Batteries
- 2023.07.12 Business Resonac Automates Material Inspection by Utilizing Deep Learning-Based Image Analysis
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2023.06.27
Business
“JOINT2” Consortium Enhances Its Proposal Capability for the Development of Next-Generation Semiconductor Packaging Technologies
— With joining of ORC Manufacturing, a manufacturer of lithography equipment, JOINT2 reinforces leading-edge semiconductor manufacturing technologies for back-end processes — -
2023.06.12
Business
Resonac Decides to Acquire 100% Shares in AMI Automation
- Having 200 DX engineers, AMI will help accelerate DX across the entire Resonac Group - - 2023.05.18 Business Becoming the First in Japan to Acquire International Certification for a Supply Chain That Adopts Materials Derived from Used Plastics
- 2023.05.16 Other Resonac to exhibit at JPCA 2023 (The Total Solution Exhibition for Electronic Equipment 2023)
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2023.05.15
Management / IR
First Quarter, 2023 Consolidated Financial Results (Summary)
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2023.05.15
Management / IR
Consolidated Financial Results, First Quarter, 2023 (Presentation Material)
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2023.05.15
Management / IR
Resonac Announces Difference between Performance Forecast and Results
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2023.04.26
Business
TOYOTA Adopts Resonac’s Foamed Moldings for Use as Exterior Parts of “LEXUS RZ”
— Resonac’s original technology reduces weight of parts by more than 30% — - 2023.04.06 Business Resonac Gives Presentation on Its Effort to Strengthen Supply Chain at Japan-Malaysia Public Private Industrial Policy Dialogue
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2023.04.06
Other
Resonac to Exhibit at PCIM Europe
The leading international exhibition and conference for power electronics in Nürnberg Germany, May 9th-11th -
2023.04.04
Business
Resonac Increases Production Capacity for Adhesive Film for Semiconductor Packaging by 60%
—Aiming to cope with medium- to long-term increase in demand— - 2023.04.04 Management / IR Resonac Group to Integrate and Relocate Head Offices
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2023.04.03
Other
Be Co-creative, and Let’s Achieve Reform Together
—President Takahashi sends message at the first company entrance ceremony of Resonac — -
2023.03.31
Management / IR
Resonac Corporation Signs Contract to Transfer Shares of Diagnostic Reagent Subsidiaries in Japan, China and the United States
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2023.03.31
Business
DENSO Adopts Resonac’s SiC Epi-wafer for Power Semiconductor for Use in Inverter
—The new inverter will be installed in Toyota’s new BEV “LEXUS RZ” — -
2023.03.31
Management / IR
Mr. Tsuneishi Takes Office as Outside Director of Resonac Holdings
— Former Chairman of a semiconductor production equipment company will help Resonac to strengthen management power to compete in the semiconductor materials market — -
2023.03.13
R&D
Resonac Starts Development of New Semiconductor Materials for 6G at the Newly Opened Innovation Base
- With Computational Science and Materials Analysis Professionals Also Stationed at the Same Resonac R&D Center - -
2023.03.08
Other
Resonac Wins the Grand Prix at NIKKEI Integrated Report Award 2022
— “Message from the top management” in our report obtained full marks in the screening process of the Award — -
2023.03.02
Other
Notice of Convocation of the 114th Ordinary General Meeting of Shareholders
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2023.03.01
Business
Resonac Develops and Starts to Mass-produce Third Generation High-grade SiC Epitaxial Wafers
— Through supply of top-quality epitaxial wafers, Resonac contributes to practical application of space-saving high-output next-generation power semiconductors — -
2023.02.15
R&D
RESONAC (Semiconductor Materials Manufacturer in Japan) to Use Virtual Reality Technology for Product Development
~ Enables engineers to experience "molecular level visualization," and makes a significant contribution to accelerating development and discovery of new materials ~ -
2023.02.14
Management / IR
2022 Consolidated Financial Statements and Summary
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2023.02.14
Management / IR
2022 Financial Results: Presentation Material
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2023.02.14
Management / IR
【CEO Presentation Material】"Co-Creative Chemical Company" -toward global top-level functional chemical company-
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2023.02.14
Management / IR
Resonac Announces Difference between Performance Forecast and Results
-
2023.02.14
Management / IR
(Correction) Resonac Corrects Segment Information in 2021 Consolidated Financial Statements
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2023.02.09
R&D
Resonac Joins Enthought’s Materials Informatics Acceleration Program
-Enhancing skill development of Resonac’s data scientists- -
2023.01.17
R&D
Resonac Starts Full-Scale Operation of Evaluation and Development Base to Innovate Materials for Power Modules
- For Contribution to the Electrification of Vehicles and Others through Co-Creation with External Parties - - 2023.01.16 Other We exhibit at nano tech 2023 - The 22nd International Nanotechnology Exhibition & Conference
- 2023.01.12 Business Resonac and Infineon Technologies Strengthen Cooperation in SiC Materials for Power Semiconductors
- 2023.01.06 Other We exhibit at 14th EV&HV, PHV Technology Expo (in AUTOMOTIVE WORLD2023)
- 2023.01.06 Other We exhibit at 37th NEPCON JAPAN (R&D and Manufacturing)
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2023.01.04
Management / IR
Resonac Aims to be a Leading Functional Chemical Manufacturer by Raising Reformers
-CEO Takahashi Gives New Year Address following the Launch of Resonac-
-
2023.08.08
Management / IR
Consolidated Financial Statements for the first half year (Jan. 1 to Jun. 30, 2023)
-
2023.08.08
Management / IR
Consolidated Financial Results, Second Quarter, 2023 (Presentation Material)
-
2023.08.08
Management / IR
Resonac Announces Difference between Performance Forecast and Results
-
2023.05.15
Management / IR
First Quarter, 2023 Consolidated Financial Results (Summary)
-
2023.05.15
Management / IR
Consolidated Financial Results, First Quarter, 2023 (Presentation Material)
-
2023.05.15
Management / IR
Resonac Announces Difference between Performance Forecast and Results
- 2023.04.04 Management / IR Resonac Group to Integrate and Relocate Head Offices
-
2023.03.31
Management / IR
Resonac Corporation Signs Contract to Transfer Shares of Diagnostic Reagent Subsidiaries in Japan, China and the United States
-
2023.03.31
Management / IR
Mr. Tsuneishi Takes Office as Outside Director of Resonac Holdings
— Former Chairman of a semiconductor production equipment company will help Resonac to strengthen management power to compete in the semiconductor materials market — -
2023.02.14
Management / IR
2022 Consolidated Financial Statements and Summary
-
2023.02.14
Management / IR
2022 Financial Results: Presentation Material
-
2023.02.14
Management / IR
【CEO Presentation Material】"Co-Creative Chemical Company" -toward global top-level functional chemical company-
-
2023.02.14
Management / IR
Resonac Announces Difference between Performance Forecast and Results
-
2023.02.14
Management / IR
(Correction) Resonac Corrects Segment Information in 2021 Consolidated Financial Statements
-
2023.01.04
Management / IR
Resonac Aims to be a Leading Functional Chemical Manufacturer by Raising Reformers
-CEO Takahashi Gives New Year Address following the Launch of Resonac-
-
2023.09.15
Business
Resonac Announces Termination of HD Media Business in Taiwan
-
2023.08.03
Business
Resonac’s Oita Complex Acquires ISCC PLUS certification
-Resonac takes a step toward carbon neutrality by introducing biomass material into its ethylene plant- - 2023.07.26 Business Japan Patent Office Decides to Maintain Validity of Resonac’s Four Patents on Anode Materials for Lithium-ion Batteries
- 2023.07.12 Business Resonac Automates Material Inspection by Utilizing Deep Learning-Based Image Analysis
-
2023.06.27
Business
“JOINT2” Consortium Enhances Its Proposal Capability for the Development of Next-Generation Semiconductor Packaging Technologies
— With joining of ORC Manufacturing, a manufacturer of lithography equipment, JOINT2 reinforces leading-edge semiconductor manufacturing technologies for back-end processes — -
2023.06.12
Business
Resonac Decides to Acquire 100% Shares in AMI Automation
- Having 200 DX engineers, AMI will help accelerate DX across the entire Resonac Group - - 2023.05.18 Business Becoming the First in Japan to Acquire International Certification for a Supply Chain That Adopts Materials Derived from Used Plastics
-
2023.04.26
Business
TOYOTA Adopts Resonac’s Foamed Moldings for Use as Exterior Parts of “LEXUS RZ”
— Resonac’s original technology reduces weight of parts by more than 30% — - 2023.04.06 Business Resonac Gives Presentation on Its Effort to Strengthen Supply Chain at Japan-Malaysia Public Private Industrial Policy Dialogue
-
2023.04.04
Business
Resonac Increases Production Capacity for Adhesive Film for Semiconductor Packaging by 60%
—Aiming to cope with medium- to long-term increase in demand— -
2023.03.31
Business
DENSO Adopts Resonac’s SiC Epi-wafer for Power Semiconductor for Use in Inverter
—The new inverter will be installed in Toyota’s new BEV “LEXUS RZ” — -
2023.03.01
Business
Resonac Develops and Starts to Mass-produce Third Generation High-grade SiC Epitaxial Wafers
— Through supply of top-quality epitaxial wafers, Resonac contributes to practical application of space-saving high-output next-generation power semiconductors — - 2023.01.12 Business Resonac and Infineon Technologies Strengthen Cooperation in SiC Materials for Power Semiconductors
-
2023.03.13
R&D
Resonac Starts Development of New Semiconductor Materials for 6G at the Newly Opened Innovation Base
- With Computational Science and Materials Analysis Professionals Also Stationed at the Same Resonac R&D Center - -
2023.02.15
R&D
RESONAC (Semiconductor Materials Manufacturer in Japan) to Use Virtual Reality Technology for Product Development
~ Enables engineers to experience "molecular level visualization," and makes a significant contribution to accelerating development and discovery of new materials ~ -
2023.02.09
R&D
Resonac Joins Enthought’s Materials Informatics Acceleration Program
-Enhancing skill development of Resonac’s data scientists- -
2023.01.17
R&D
Resonac Starts Full-Scale Operation of Evaluation and Development Base to Innovate Materials for Power Modules
- For Contribution to the Electrification of Vehicles and Others through Co-Creation with External Parties -
- 2023.05.16 Other Resonac to exhibit at JPCA 2023 (The Total Solution Exhibition for Electronic Equipment 2023)
-
2023.04.06
Other
Resonac to Exhibit at PCIM Europe
The leading international exhibition and conference for power electronics in Nürnberg Germany, May 9th-11th -
2023.04.03
Other
Be Co-creative, and Let’s Achieve Reform Together
—President Takahashi sends message at the first company entrance ceremony of Resonac — -
2023.03.08
Other
Resonac Wins the Grand Prix at NIKKEI Integrated Report Award 2022
— “Message from the top management” in our report obtained full marks in the screening process of the Award — -
2023.03.02
Other
Notice of Convocation of the 114th Ordinary General Meeting of Shareholders
- 2023.01.16 Other We exhibit at nano tech 2023 - The 22nd International Nanotechnology Exhibition & Conference
- 2023.01.06 Other We exhibit at 14th EV&HV, PHV Technology Expo (in AUTOMOTIVE WORLD2023)
- 2023.01.06 Other We exhibit at 37th NEPCON JAPAN (R&D and Manufacturing)