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Solution
We in Resonac propose various effective solutions for the problem-solving in manufacturing and technology development.
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- Solution
Resonac’s Thermal Insulation Coating provides excellent heat insulation, low thermal conductivity of 0.03 W/(m･K), and corrosion resistance, making it ideal for insulation of EVs’ refrigerant pipes.
- Solution
Used as a sealing material primer, "HIMAL" increases adhesion between the lead frame, semiconductor devices or wires and the sealing material, and reduces internal stress. The reliability of power semiconductors is improved by raising the sealing material’s heat resistance while preventing delamination.
- Solution
Die bonding material with low elasticity, excellent stress relaxation, and high adhesive strength. Reliable die bonding can be achieved without additional cost.
- Solution
Resonac’s <AR-5100> is a positive photosensitive material for FOWLP RDLs, using a phenol resin for high resolution. <AR-5100> is NMP-free and alkaline developable.
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