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- 2023.01.12 Business Resonac and Infineon Technologies Strengthen Cooperation in SiC Materials for Power Semiconductors
- 2022.12.21 Business Showa Denko to Increase VGCFTM Production Capacity by 30%,Aiming to Extend Life of LIBs and Reduce CO2 Emission
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2022.12.20
Business
Showa Denko’s Low-Carbon Ammonia Produced from Used Plastics Reduces CO2 Emission by more than 80%
- SDK’s low-carbon ammonia shows excellent environmental performance verified by a calculation method endorsed by a third party-
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New thermal conductive filler with high thermal conductivity, insulation reliability and moisture resistance.
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A modified polyimide resin that has both insulation and flexibility. Achieved excellent insulation reliability, detergent resistance, salt water resistance, and low leakage current.
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"FANCRYL" <500 series> has a bulky DCPD structure that it contributes to low cure shrinkage when added to 3D print resin formulations.
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