Products
News Releases
-Resonac takes a step toward carbon neutrality by introducing biomass material into its ethylene plant-
Resonac, No.1 semiconductor back-end process materials
Subscribe our eNewsletter
Get the latest knowledge and solutions to accelerate your business growth.
Search by Category
Semi Frontend Process Electronic Material Gases, LED Chips, Abrasive 
Semi Backend Process Semiconductor Relate Materials, Display Related Materials, Film 
Materials for PWBsBase Materials, Photosensitive Materials 
Device Solutions Hard Disk, SiC 
Automotive Products Molded Plastics/Sheet-formed Products, Powder Metal Products 
Lithium-ion battery Materials Products for Battery, Carbon Products 
Innovation Materials Ceramics Products, Functional Resin, Specialty Chemical Materials, Resins, Adhesives, Tapes, Aluminum Products 
Chemicals Basic Chemicals, Industrials Gases, Elastomers 
Graphite Graphite 
Others Life Sciences, Others
Solution
We in Resonac propose various effective solutions for the problem-solving in manufacturing and technology development.
Pick up
- Solution
Resonac’s Thermal Insulation Coating provides excellent heat insulation, low thermal conductivity of 0.03 W/(m･K), and corrosion resistance, making it ideal for insulation of EVs’ refrigerant pipes.
- Solution
Used as a sealing material primer, "HIMAL" increases adhesion between the lead frame, semiconductor devices or wires and the sealing material, and reduces internal stress. The reliability of power semiconductors is improved by raising the sealing material’s heat resistance while preventing delamination.
- Solution
Die bonding material with low elasticity, excellent stress relaxation, and high adhesive strength. Reliable die bonding can be achieved without additional cost.
- Solution
Resonac’s <AR-5100> is a positive photosensitive material for FOWLP RDLs, using a phenol resin for high resolution. <AR-5100> is NMP-free and alkaline developable.
1
4