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The consortium will help to further advance technology in back-end packaging, an area that has not been significantly focused on in the US
―Aiming to start production of pads with superior braking power and abrasion resistance in 2026―
Resonac, No.1 semiconductor back-end process materials
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Semi Frontend Process High-Purity Gas, Abatement Systems/Surface Treatment, High-Purity Solvent, CMP Slurry, Anti-charging Material
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We in Resonac propose various effective solutions for the problem-solving in manufacturing and technology development.
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Resonac’s Thermal Insulation Coating provides excellent heat insulation, low thermal conductivity of 0.03 W/(m・K), and corrosion resistance, making it ideal for insulation of EVs’ refrigerant pipes.
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Used as a sealing material primer, "HIMAL" increases adhesion between the lead frame, semiconductor devices or wires and the sealing material, and reduces internal stress. The reliability of power semiconductors is improved by raising the sealing material’s heat resistance while preventing delamination.
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Die bonding material with low elasticity, excellent stress relaxation, and high adhesive strength. Reliable die bonding can be achieved without additional cost.
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Resonac’s <AR-5100> is a positive photosensitive material for FOWLP RDLs, using a phenol resin for high resolution. <AR-5100> is NMP-free and alkaline developable.