Products
News Releases
―Ammonia-fueled tugboat receives fuel via Truck to Ship method―
The consortium will help to further advance technology in back-end packaging, an area that has not been significantly focused on in the US
Resonac, No.1 semiconductor back-end process materials
Subscribe our eNewsletter
Get the latest knowledge and solutions to accelerate your business growth.
Search by Category
Semi Frontend Process High-Purity Gas, Abatement Systems/Surface Treatment, High-Purity Solvent, CMP Slurry, Anti-charging Material - ,
Semi Backend Process Semiconductor Relate Materials, Display Related Materials, Film 
Materials for PWBsBase Materials, Photosensitive Materials 
Components for Electronic DevicesHard Disk, SiC, Optical Semiconductor Products 
Automotive Products Molded Plastics/Sheet-formed Products, Powder Metal Products, Aluminum Products 
Lithium-ion battery Materials Products for Battery, Carbon Products 
Innovation Materials Ceramics, Functional Resin, Chromatography, Cosmetic Ingredients, Functional Monomer, Resins, Adhesives, Tapes 
Chemicals Basic Chemicals, Industrials Gases, Elastomers 
Graphite Graphite 
Others Others
Solution
We in Resonac propose various effective solutions for the problem-solving in manufacturing and technology development.
Pick up
- Solution
Resonac’s RF module substrate “HS200 (D)” features low Dk, low Df, low CTE, and high Tg. With a lower Dk than conventional models, this can be thinned and multilayered to realize smaller modules.
- Solution
Resonac’s PCBN is sintered material with both hardness and fracture resistance. It contributes to extend tool life by reducing occurrence of sudden chipping during lathe machining of stiff objects.
- Solution
Resonac’s low-melting glass contains no substances restricted by the EU’s RoHS Directive and enables sealing at low temperatures, thereby contributing to reduced energy consumption in manufacturing of vacuum insulated glass.
1
4