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News Releases
- 2023.05.18 Business Becoming the First in Japan to Acquire International Certification for a Supply Chain That Adopts Materials Derived from Used Plastics
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2023.04.26
Business
TOYOTA Adopts Resonac’s Foamed Moldings for Use as Exterior Parts of “LEXUS RZ”
— Resonac’s original technology reduces weight of parts by more than 30% — - 2023.04.06 Business Resonac Gives Presentation on Its Effort to Strengthen Supply Chain at Japan-Malaysia Public Private Industrial Policy Dialogue
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Semi Frontend Process Electronic Material Gases, LED Chips, Abrasive 
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Solution
We in Resonac propose various effective solutions for the problem-solving in manufacturing and technology development.
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- Solution
Used as a sealing material primer, "HIMAL" increases adhesion between the lead frame, semiconductor devices or wires and the sealing material, and reduces internal stress. The reliability of power semiconductors is improved by raising the sealing material’s heat resistance while preventing delamination.
- Solution
Die bonding material with low elasticity, excellent stress relaxation, and high adhesive strength. Reliable die bonding can be achieved without additional cost.
- Solution
Adhesive film with excellent adhesion to fluororesin. Low-temperature pressurization at 200°C enables multi-layering of fluororesin substrates.
- Solution
It is a high dielectric constant molding material with excellent workability. Due to its low dielectric loss tangent, it exhibits excellent transmission performance even in high frequency bands.
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