Magnetic Molding Compound for Inductors
About the product
Resonac’s Magnetic Molding Compound is designed to mold inductor coils in power circuits, etc.
With this technology achieved through the development of semiconductor package encapsulation solutions, Resonac provides high-performance molding compound for inductors.

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Merits
- Realizes high inductance and high voltage resistance of inductor parts with a large concentration of highly permeable metal powder.
- Applicable to highly productive transfer/compression molding; capable of low-pressure molding and filling in small gaps.
- Superior strength and high voltage resistance contribute to improved reliability of devices.
Characteristics
Applications and features of each grade
- *1 Measured with a toroidal core (φ20*12*2 mmt) formed by transfer molding (175℃/6.9MPa).
- *2 Number of winding: 20 turns/5 turns; Bm: 5 mT; testing equipment: SY-8218 (Iwatsu).
- *3 φ50*2mmt disk-shaped test piece
Cross section of winding coil inductor

Adopting a magnetic molding in low-pressure molding helps prevent loosening or deformation of coils or cracks inside the inductor.
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