ACF (Anisotropic Conductive Film) for Film Substrate Connections
AC Series
About the product
Resonac’s ACF connects film substrates, such as FPC and COF, to display panels. Resonac pioneered this film material that combines thermosetting resins and conductive particles to achieve both conductive and insulative properties.
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Merits
- Completes interconnections and insulation between electrodes with single thermo-compression bonding.
- Capable of packaging heat-sensitive components with low-temperature, short-time connections (e.g., 170℃ /5 sec).
- Supports 20 um-pitch circuits and contributes to the miniaturization of devices.
- Ensures circuit reliability with high adhesive strength.
Characteristics
| Item | Unit | AC-3000 series | AC-7000 series | AC-10000 series | AC-2000 series | AC-9000 series | |
|---|---|---|---|---|---|---|---|
| Application | – | FPC | FPC | COF | FPC, COF | COF | |
| Fine pitch capability | Minimum contact area | µm2 | 12,000 | 29,000 | 3,000 | 50,000 | 50,000 |
| Minimum space | µm | 15 | 15 | 10 | 50 | 50 | |
| Bonding condition | Temperature | ºC | 160~ | 180~ | 170~ | 180~ | 160~ |
| Time | sec | 5~ | 5~ | 5~ | 10~ | 5~ | |
| Pressure | MPa | 3~ | 3~ | 3~ | 3~ | 3~ | |
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