ACF (Anisotropic Conductive Film) for Solderless Connections
MF Series
About the product
Resonac’s ACF for solderless connections connects components with fine-pitch circuits, such as image sensors, to substrates with low-temperature thermo-compression bonding instead of solder.
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Merits
- Packaging with only pasting and thermo-compression bonding and a significantly lower number of processes than the standard solder plating method for fine-pitch circuit connections.
- Capable of packaging heat-sensitive components with low-temperature, short-time connections (100-240℃, 4-60 sec) as well as connecting at narrow pitches.
- Thickness less than soldering contributes to thinning devices.
- Achieves superior connection reliability with high adhesive strength and low connection resistance.
Characteristics
| Item | Unit | MF-500 series | |
|---|---|---|---|
| Application | – | Solderless connection film | |
| Fine pitch capability | Minimum contact area | μm2 | 30,000 |
| Minimum space | μm | 100 | |
| Bonding condition |
Temperature | ºC | 120~ |
| Time | sec | 10~ | |
| Pressure | MPa | 1~ | |
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