Semi Frontend Process

Resonac’s high-purity gas used for cleaning film deposition chambers in semiconductor manufacturing and chosen mainly for 12-inch CVD equipment.

Resonac’s high-purity gas used for conductor etching in semiconductor manufacturing is chosen for various types of etching and forming SiOF or optical fibers.

Resonac’s high-purity gas used for etching insulating films in semiconductor manufacturing is particularly suitable for etching oxide films and chosen for etching natural oxide films on the surface of silicon.

Resonac’s high-purity gas used for etching insulating films in semiconductor manufacturing is particularly suitable for etching organic films and chosen for etching carbon masks.

Resonac’s gas used for forming conductor film in semiconductor manufacturing is particularly suitable for the deposition of silicon films and chosen for forming silicon channel films as well as cleaning.

Resonac’s high-purity gas used for etching insulating films in semiconductor manufacturing, and particularly suitable for etching nitride films.

A material for forming a removable polymer conductive film on the surface of semiconductor wafers or glass.​ The coating layer demonstrates high electronic conductivity.​

HS-0 series efficiently removes high step-height oxide pattern, typically used for memory manufacturing process.

HS-T series is suitable for polishing films containing Cu, barrier metal, and SiO2 films, typically used for interconnect fabrication process.

HS-1 series selectively removes SiO2 over other stopper films, making the slurry useful for STI process. Our unique nano ceria abrasive has small particle size with highly reactive surface, enabling ultra-low defect while maintaining high removal rate. Nano ceria abrasive is prepared via liquid-phase synthesis, in contrast to our other ceria slurries.

Resonac’s treatment uses the electroless plating method to deposit multilayer nickel (Ni) alloy film coatings on the metal surface of semiconductor manufacturing equipment. This surface treatment generates various properties that include corrosion resistance to corrosive gas atmospheres, wear resistance to sliding mechanical components, high mold releasability for rubber and other molds, and reduced mold contamination.

Resonac’s exhaust gas treatment equipment can discharge greenhouse gas perfluorocarbons (PFCs) generated in semiconductor wafer manufacturing processes as clean gases.​ Resonac offers a dry system that adopts a chemical reaction method with no water treatment required as well as a catalytic system for efficiently decomposing PFCs with high-level safety.​

A high-quality solvent for advanced semiconductors and their materials (photoresists). Resonac provides specification and quality that meet its customers’ requirements.

Resonac provides a wide range of high-purity solvents for semiconductor manufacturing processes. The products serve various purposes, and are used for washing and rinsing and as a photoresist solvent.

Resonac’s solvent for washing off residual resist, wax or flux in the manufacturing processes of semiconductors, LCDs, and electronic substrates.​

HS-8 series is oxide-selective ceria slurry that enables selective polishing of SiO2 over SiN and/or polycrystalline silicon. The abrasive used in the series is our tailor-made polycrystalline ceria. Under polishing condition, abrasive degrades, continuously exposing fresh, highly-reactive ceria surfaces which effectively removes oxide films.

Resonac’s high-purity gas used for cleaning film deposition chambers in semiconductor wafer production. Used mainly for 8-inch CVD equipment, FC-116 is also suitable for etching.

Resonac’s exhaust gas treatment equipment “Clean-S Z Series” can discharge toxic acid gases produced in the dry etching process of aluminium (Al), polycrystalline silicon (poly-Si), and silicon dioxide (SiO2) films in semiconductor manufacturing as safe and clean gases. ​ In 1985, Resonac was the first company to develop and market acid gas abatement systems, and has delivered 7,000 detoxifying cylinders and more than 1,000 storage units. ​

Resonac’s high-purity gas used for conductor etching in semiconductor manufacturing is particularly suitable for etching polysilicon.

Resonac’s high-purity gas used for the deposition of insulating films in semiconductor manufacturing, and particularly suitable for forming nitride films.

Resonac’s high-purity gas used for etching insulating films in semiconductor manufacturing, and particularly suitable for etching oxide films.

Resonac’s high-purity gas used for etching insulating films in semiconductor manufacturing, and particularly suitable for etching oxide films.

Resonac’s high-purity gas used for etching insulating films in semiconductor manufacturing, and particularly suitable for etching oxide films.

Resonac’s high-purity gas used for etching insulating films in semiconductor manufacturing, and particularly suitable for etching oxide films.

Resonac’s high-purity gas used for deposition of insulating films in semiconductor manufacturing, and particularly suitable for forming oxide films.

Resonac’s high-purity gas used for conductor etching in semiconductor manufacturing is particularly suitable for etching polysilicon and chosen for forming TSVs (through-silicon vias).

Resonac’s high-purity gas used for conductor etching in semiconductor manufacturing is particularly suitable for etching polysilicon and chosen for selective etching of leading-edge logic semiconductors.

Resonac’s high-purity gas used for conductor etching in semiconductor manufacturing is particularly suitable for etching metals and chosen for gate etching of leading-edge logic semiconductors.