Epoxy Molding Compounds for Organic Substrates
CEL Series
About the product
Resonac’s epoxy molding compounds is suitable for semiconductor packages assembled with organic substrates such as BGA and CSP.
![Image of for Substrate](/sites/default/files/2022-11/001_23.jpeg)
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Merits
- Control package warpage by controlling the elastic modulus and thermal expansion.
- Excellent reflow resistance with superior thermal resistance and adhesiveness.
- Applicable to transfer molding underfill (MUF).
- Applicable to low Dk/Df requirement for high frequency applications such as 5G.
- Excellent filling ability in small gaps as in SiP modules.
- Applicable to compression molding.
![](/sites/default/files/2022-11/012ph1.jpeg)
Applicable packages: CSP, BGA, Stacked MCP, etc.
Characteristics
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