Epoxy Molding Compounds for Organic Substrates
CEL Series
About the product
Resonac’s epoxy molding compounds is suitable for semiconductor packages assembled with organic substrates such as BGA and CSP.
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Merits
- Control package warpage by controlling the elastic modulus and thermal expansion.
- Excellent reflow resistance with superior thermal resistance and adhesiveness.
- Applicable to transfer molding underfill (MUF).
- Applicable to low Dk/Df requirement for high frequency applications such as 5G.
- Excellent filling ability in small gaps as in SiP modules.
- Applicable to compression molding.
Characteristics
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