Epoxy Molding Compounds for Lead Frame
CEL Series
About the product
Resonac’s epoxy molding compounds seal and protect the areas around the chips of semiconductor packages assembled with various metal lead frames.
Resonac has established a supply system to globally provide these materials from five sites.
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Merits
- Excellent moisture and thermal shock resistance.
- Excellent reflow crack resistance.
- Suitable for automotive grade semiconductors by using high-purity materials and strict quality control.
- Extensive product lineup satisfies the need for materials with high thermal resistance, heat conductivity, high CTI, etc.
Applicable packages:
DIP, SOP, TSOP, QFP, TQFP, LQFP, etc.
Characteristics
| Item | Unit | CEL-9240 ZHF10HT3W |
CEL-9240 HF10 |
CEL-8240 HF10 |
CEL-9200 HF10 |
CEL-9200 HF9 |
|
|---|---|---|---|---|---|---|---|
| Applications | - | QFP,SOP,QFN,PLCC | QFP,SOP,TSOP | QFP,SOP,QFN,PLCC | QFN | ||
| Flame retardant type | - | No flame retardant |
No flame retardant |
No flame retardant |
No flame retardant |
Organic phosphorous |
|
| Spiral flow | cm | 140 | 100 | 120 | 100 | 110 | |
| Glass transition temperature | ºC | 125 | 110 | 110 | 125 | 110 | |
| Thermal expansion | α1 | ppm/ºC | 12 | 7 | 8 | 8 | 8 |
| α2 | ppm/ºC | 38 | 28 | 35 | 33 | 32 | |
| Flexural modulus | GPa | 30 | 33 | 25 | 27 | 27 | |
| Mold shrinkage | % | 0.15 | 0.16 | 0.17 | 0.17 | 0.22 | |
| Thermal conductivity | W/mK | 3 | - | - | - | - | |
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