Materials for PWBs

Resonac’s copper clad laminates (CCL) and prepregs are ideally suited for high-capacity, high-speed signal transmission in applications such as AI servers, high-speed routers, and 5G/6G communication antennas.

Resonac’s copper clad laminates (CCL) and prepregs for semiconductor packages support the increasing size of flip chip packages, including 2.xD packages, as well as the thinning of packages such as SiP and AiP.

Resonac’s photosensitive solder resist materials protect and insulate high-density wiring used for semiconductor packages.

Resonac’s photosensitive materials designed to form thick resist pattern layers are used for such applications as the copper plating process of printed wiring boards requiring a high aspect ratio and electroforming in metal mask manufacturing.

Resonac’s photosensitive resist materials designed to form fine-pitch circuits on semiconductor package substrates can form circuits with a film thickness of 10 um or less and a width of 4 um or less.

Resonac’s resist materials for forming printed wiring board circuits are applicable to direct-writing exposure machines that pattern circuits using laser beams.