Materials for PWBs

Resonac offers base materials suitable for substrates of automotive radars and engine room components.

Resonac provides ideal base materials for PWBs, designed for large data transmission with high-frequency signals, such as multilayer boards for servers and routers and antenna module substrates.

Resonac’s base materials for mounting semiconductor devices and packages fit the requirements of larger flip chips, including 2.xD packages, and thinning of packages such as SiP or AiP.

Resonac’s photosensitive solder resist materials protect and insulate high-density wiring used for semiconductor packages.

Resonac’s photosensitive materials designed to form thick resist pattern layers are used for such applications as the copper plating process of printed wiring boards requiring a high aspect ratio and electroforming in metal mask manufacturing.

Resonac’s photosensitive resist materials designed to form fine-pitch circuits on semiconductor package substrates can form circuits with a film thickness of 10 um or less and a width of 4 um or less.

Resonac’s resist materials for forming printed wiring board circuits are applicable to direct-writing exposure machines that pattern circuits using laser beams.