Dicing Tape
HAE Series
About the product
Resonac’s non-UV-type adhesive tape has been used to secure parts during the dicing process of manufacturing semiconductors, electronic devices and optical components.
The product has been used for over 40 years in various applications, including the processing of silicon, ceramics and chip LEDs.
Inquiry of this product
Merits
- Using non-UV-type adhesive, UV irradiation is not required during processing.
- Fits various chip sizes with widely ranging grades of adhesive strength.
- With good expansion, exhibits high pick-up performance even with small chips.
- RoHS-compliant products are also available for proposal. (HAE-1700 Series (under development))
Characteristics
| Item | Unit | HAE-1503 | HAE-1504 | HAE-1506 | |
|---|---|---|---|---|---|
| Features | - | • Non-UV type • Good expansion |
|||
| Structure (sectional diagram) | - |  |
|
|
|
| Standard adhesion nominal value | N/25 mm | 0.49 | 0.78 | 2.45 | |
| Size | Thickness of base film | μm | 80 | ||
| Width | mm | ~400 | |||
| Length | m | 100 | |||
| Base film | Material | - | PVC | ||
| Color | - | Blue | |||
| Separator material | - | Paper type (Silicone coating) | |||
| Examples of applicable chip sizes | - | Large ⇔ Small | |||
- ※ Standard adhesion indicates measured values using a stainless adherend with a peeling angle of 90 degrees, peeling speed of 200 mm/minute, temperature of 23℃, and relative humidity of 50%.
- ※ Please consult us about your size requirements (width, length).
Inquiry of this product