Semiconductor / Electronics Related Technologies

In electronic devices, IC chips are assembled onto package substrates at high temperatures. Due to the difference in thermal expansion coefficients between the chip and the substrate, significant warpage can occur during cooling, which may lead to delamination at the joints.
To address this issue, Resonac has developed a unique hybrid resin structure that combines hard and soft segments, together with high filler loading. This design reduces the thermal expansion coefficient of the package substrate and effectively suppresses warpage.

CMP slurry is used to planarize the surface of semiconductor wafers. By reducing the particle size of cerium oxide abrasives to the nanometer scale and narrowing the particle size distribution, Resonac has dramatically reduced polishing scratches.
Although smaller abrasives typically decrease polishing speed, our nano-ceria particles maintain high surface reactivity, achieving polishing rates comparable to conventional ceria particles.

In semiconductor packages, die-bonding films are used to laminate stacked semiconductor chips. Initially, low-molecular-weight resin is uniformly dispersed within a high-molecular-weight resin. During curing, micro-phase separation occurs, forming a “sea-island structure” in which the low-molecular-weight resin becomes dispersed islands and the high-molecular-weight resin forms the continuous phase. The rigid low-molecular-weight phase provides strength, while the flexible high-molecular-weight phase relaxes stress. As curing progresses, a resin layer with both strong adhesion and flexibility is formed, effectively preventing chip-to-chip delamination. Through precise control of this microstructure, Resonac achieves both ultra-thin film formation and high adhesion performance.

Prepregs—used as insulating layers in substrate materials—are manufactured by impregnating glass cloth with resin and fillers. By precisely controlling the resin application amount during impregnation, Resonac produces prepregs with excellent surface smoothness and uniform resin layer thickness on both sides. Core substrates made from these prepregs, such as our “TYPE-F Core,” exhibit minimal thickness variation and superior surface flatness, making them ideal for AI semiconductor packages.

High-purity gases are essential for etching specific material layers during semiconductor wafer fabrication. Resonac synthesizes a wide range of high-purity fluorinated compound gases using advanced proprietary technologies. Through specialized cylinder surface treatment, cleaning processes, and high-sensitivity analytical techniques, we prevent contamination and reliably supply high-quality fluorine-based and highly corrosive etching gases.

SiC epitaxial wafers—used in power modules for electric vehicles and other high-power applications—are produced through SiC single-crystal growth, slicing, polishing, and epitaxial layer growth. During crystal and epitaxial growth, dopants must be uniformly incorporated to achieve high crystallinity and precise electrical characteristics. This requires advanced growth temperature control near 2000 °C, raw material gas flow control, and high-precision machining of extremely hard SiC to create slightly inclined crystal plane.

Energy-assisted recording technologies include:
HAMR (Heat-Assisted Magnetic Recording): Localized heating of the recording layer using near-field optics and a laser diode during magnetic recording.
MAMR (Microwave-Assisted Magnetic Recording): Application of high-frequency magnetic fields generated by a spin-torque oscillator (STO) to the recording layer during magnetic recording.
These technologies reduce the area required to record a single bit, enabling higher HDD capacities. Resonac develops and supplies hard disk media equipped with new magnetic layers optimized for HAMR and MAMR.