Thermal Conductive Sheets for Semiconductor Packages

TC Series

About the product

Resonac’s thermal conductive sheets (TIM material) with electrical conductivity efficiently release heat from IC chips when applied a semiconductor package, and between IC chip and a heat spreader, heatsink or heat pipe.

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Applications

Examples

(1)Desktop PC, Server

(2)Notebook PC

(3)Power module

Target Fields

  • The product’s superior thermal conductivity and cooling effect are expected to contribute to enhancing electronic device reliability and energy efficiency.

Benefits

  • Achieves high thermal conductivity in the thickness direction by vertically aligned graphite fillers.
  • Increases thermal conductivity by flexibly filling in gaps caused by differences in chip heights or uneven adhesive interface.
  • Possible to temporarily fix on heat modules with slight adhesiveness.
  • Applicable to next-generation large devices by flexibly fitting warped substrates.

Cross section of a thermal conductive sheet

Characteristics

Item TC Series Conventional products
TC-001 TC-HM03 TC-001D TC-S01A Silicone sheet Grease Indium
Features Standard Phase-change type High strength type Single-side reuse / repair [Laminated Al foil] Comparison Comparison Comparison
Thermal conductivity (W/m⋅K) 40 - 90 40 - 90 40 - 90 40 - 90 2 1 - 10 80
Effective thermal conductivity (W/m⋅K) 25 - 45 25 - 45 25 - 45 7 - 15 - - 70
Hardness Asker C 50 - 70 40 - 50 70 - 90 40 - 60 20 - 50 - >100
Adhesiveness (Nmm) 3.5 - 5.0 4.5 - 6.0 1.4 - 1.8 5.0 - 6.5 9 - 15 0 0
Thickness (mm) 【Our recommendation】 0.15 - 2.0 
【0.15 - 0.5】		 0.15 - 2.0 
【0.15 - 0.5】		 0.15 - 2.0 
【0.15 - 0.5】		 0.2 - 2.0 
【0.2 - 0.5】		 0.2 - 2.0 - 0.2
Tensile strength (MPa) 0.2 0.15 0.5 7 0.2 - -
Recommended assemble pressure (MPa) 0.3 - 1.0 0.15 - 0.6 1.0 - 3.0 0.3 - 1.0 - - -

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