Thermal Conductive Sheets for Semiconductor Packages
TC Series
About the product
Resonac’s thermal conductive sheets (TIM material) with electrical conductivity efficiently release heat from IC chips when applied a semiconductor package, and between IC chip and a heat spreader, heatsink or heat pipe.
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Merits
- Achieves high thermal conductivity in the thickness direction by vertically aligned graphite fillers.
- Increases thermal conductivity by flexibly filling in gaps caused by differences in chip heights or uneven adhesive interface.
- Possible to temporarily fix on heat modules with slight adhesiveness.
- Applicable to next-generation large devices by flexibly fitting warped substrates.
Cross section of a thermal conductive sheet
Characteristics
| Item | TC Series | Conventional products | |||||
|---|---|---|---|---|---|---|---|
| TC-001 | TC-HM03 | TC-001D | TC-S01A | Silicone sheet | Grease | Indium | |
| Features | Standard | Phase-change type | High strength type | Single-side reuse / repair [Laminated Al foil] | Comparison | Comparison | Comparison |
| Thermal conductivity (W/mK) | 40-90 | 40-90 | 40-90 | 40-90 | 2 | 1-10 | 80 |
| Effective thermal conductivity (W/mK) | 25-45 | 25-45 | 25-45 | 7-15 | - | - | 70 |
| Hardness Asker C | 50-70 | 40-50 | 70-90 | 40-60 | 20-50 | - | >100 |
| Adhesiveness (Nmm) | 3.5-5.0 | 4.5-6.0 | 1.4-1.8 | 5.0-6.5 | 9-15 | 0 | 0 |
| Thickness (mm) 【Our recommendation】 | 0.15-2.0 【0.15-0.5】 |
0.15-2.0 【0.15-0.5】 |
0.15-2.0 【0.15-0.5】 |
0.2-2.0 【0.2-0.5】 |
0.2-2.0 | - | 0.2 |
| Tensile strength (MPa) | 0.2 | 0.15 | 0.5 | 7 | 0.2 | - | - |
| Recommended assemble pressure (MPa) | 0.3-1.0 | 0.15-0.6 | 1.0-3.0 | 0.3-1.0 | - | - | - |
Application example
(1)Desk top PC, Server
(2)Note book PC
(3)Power module
Expected field of application
- The product’s superior thermal conductivity and cooling effect are expected to contribute to enhancing electronic device reliability and energy efficiency.
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