Molding Film
EB series
About the product
Resonac's Molding Film (EB series) is a film-type molding material that protects chips, components and wiring. High embeddability and low warpage enables easy molding of large panels and thin packages.
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Benefits
- Applicable for molding protection of chips and components and for protection of embedded wiring.
- Realization of molding for large panels such as FO-PLP and ultra-thin packages taking advantage of low warpage and crack resistance.
- Provides a simple molding process using laminating equipment.
- Resonac's specific technology can suppress warpage in addition to low thermal expansion and low temperature curing resin characteristics.
- High flowability enables low-pressure molding and high aspect ratio and narrow gap filling.
Characteristics
High Embeddability
Issue: difficult to fill high aspect ratio and narrow gap areas with epoxy molding compound.
Solution: High flowability of EB series resin enables embedding the narrow gap.
Depth 300 μm / Gap 25 μm
Depth 300 μm / Gap 100 μm
Low Warpage
Issue: Warpage of workpiece due to increasing panel size
Solution: Resonac's specific technology can suppress warpage in addition to low thermal expansion and low temperature curing resin characteristics.
General molding film
Resonac's EB series
*Composition: molding film (50 μmt)/PCB(E-705G) (200 μmt)
Application Examples
(1)Peeling off cover film
(2)Lamination
(3)Curing
(4)Peeling off carrier film
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