Molding Film
EB series
About the product
Resonac's Molding Film (EB series) is a film-type molding material that protects chips, components and wiring. High embeddability and low warpage enables easy molding of large panels and thin packages.
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Merits
- Applicable for molding protection of chips and components and for protection of embedded wiring.
- Realization of molding for large panels such as FO-PLP and ultra-thin packages taking advantage of low warpage and crack resistance.
- Provides a simple molding process using laminating equipment.
- Resonac's specific technology can suppress warpage in addition to low thermal expansion and low temperature curing resin characteristics.
- High flowability enables low-pressure molding and high aspect ratio and narrow gap filling.
High embeddability
Issue: difficult to fill high aspect ratio and narrow gap areas with epoxy molding compound.
Solution: High flowability of EB series resin enables embedding the narrow gap.
Depth 300μm / Gap 25μm
Depth 300μm / Gap 100μm
Low warpage
Issue: Warpage of workpiece due to increasing panel size
Solution: Resonac's specific technology can suppress warpage in addition to low thermal expansion and low temperature curing resin characteristics.
General molding film
Resonac's EB series
*Composition: molding film (50μmt)/PCB(E-705G) (200μmt)
Application example
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