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2023.11.22
R&D
Resonac Participates in a US-based Leading-edge Semiconductor Consortium as The First Japanese Strategic Material Manufacturing Partner
~ Conduct R&D alongside major U.S. semiconductor companies ~ -
2023.11.22
R&D
Resonac Plans to Establish Semiconductor Back End Process R&D Center in Silicon Valley
~ Resonac aims to accelerate development of cutting-edge technologies in a region where business bases of GAFAM and US semiconductor manufacturers are concentrated ~ -
2023.11.21
Management / IR
Changes in Representative Director and Other Members of Management
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2023.11.09
Management / IR
Consolidated Financial Statements for the first three quarters ended September, 2023
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2023.11.09
Management / IR
Consolidated Financial Results, Third Quarter, 2023 (Presentation Material)
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2023.11.21
Management / IR
Changes in Representative Director and Other Members of Management
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2023.11.09
Management / IR
Consolidated Financial Statements for the first three quarters ended September, 2023
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2023.11.09
Management / IR
Consolidated Financial Results, Third Quarter, 2023 (Presentation Material)
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2023.11.09
Management / IR
Resonac Revises Forecast of Consolidated Performance
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2023.10.24
Management / IR
Resonac Creates Chief Sustainability Officer (CSuO) as a New Position
—Resonac positions sustainability as its basic management policy, and will continue working on sustainability in earnest—
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2023.09.15
Business
Resonac Announces Termination of HD Media Business in Taiwan
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2023.08.03
Business
Resonac’s Oita Complex Acquires ISCC PLUS certification
-Resonac takes a step toward carbon neutrality by introducing biomass material into its ethylene plant- - 2023.07.26 Business Japan Patent Office Decides to Maintain Validity of Resonac’s Four Patents on Anode Materials for Lithium-ion Batteries
- 2023.07.12 Business Resonac Automates Material Inspection by Utilizing Deep Learning-Based Image Analysis
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2023.06.27
Business
“JOINT2” Consortium Enhances Its Proposal Capability for the Development of Next-Generation Semiconductor Packaging Technologies
— With joining of ORC Manufacturing, a manufacturer of lithography equipment, JOINT2 reinforces leading-edge semiconductor manufacturing technologies for back-end processes —
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2023.11.22
R&D
Resonac Participates in a US-based Leading-edge Semiconductor Consortium as The First Japanese Strategic Material Manufacturing Partner
~ Conduct R&D alongside major U.S. semiconductor companies ~ -
2023.11.22
R&D
Resonac Plans to Establish Semiconductor Back End Process R&D Center in Silicon Valley
~ Resonac aims to accelerate development of cutting-edge technologies in a region where business bases of GAFAM and US semiconductor manufacturers are concentrated ~ -
2023.09.22
R&D
Resonac Forms Strategic Partnership with Matmerize in Materials Informatics
－Aiming to Accelerate Development of Semiconductor Materials for 6G－
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2023.03.13
R&D
Resonac Starts Development of New Semiconductor Materials for 6G at the Newly Opened Innovation Base
- With Computational Science and Materials Analysis Professionals Also Stationed at the Same Resonac R&D Center - -
2023.02.15
R&D
RESONAC (Semiconductor Materials Manufacturer in Japan) to Use Virtual Reality Technology for Product Development
~ Enables engineers to experience "molecular level visualization," and makes a significant contribution to accelerating development and discovery of new materials ~
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2023.09.14
Sustainability
Resonac Introduces Value Creation Story Starting from Its Purpose under the Key Concept “Here We Go”
－Resonac Publishes RESONAC REPORT 2023, the Group’s First Integrated Report－ -
2022.11.02
Sustainability
Showa Denko Establishes Integrated Data Pipeline to Collect, Format, and Accumulate Experimental Data and Analyze Them with AI
- SDK has established data pipeline utilizing electronic lab notebooks. In less than a year of operation, there have already been some cases in which the data pipeline has shortened the product development period by two months - - 2021.07.30 Sustainability Showa Denko Group Challenges to Realize Carbon Neutrality by 2050
- 2020.09.08 Sustainability Showa Denko Joins “The Valuable 500”
- 2020.06.26 Sustainability Showa Denko Group Recycles 4.43 Million Aluminum Cans in FY2019
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2023.10.11
Other
Resonac Participates WIPO GREEN, a Global Platform for Environment-friendly Technologies
—Resonac accelerates co-creative innovation through registration of environmental technologies including those for plastic chemical recycling— - 2023.05.16 Other Resonac to exhibit at JPCA 2023 (The Total Solution Exhibition for Electronic Equipment 2023)
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2023.04.06
Other
Resonac to Exhibit at PCIM Europe
The leading international exhibition and conference for power electronics in Nürnberg Germany, May 9th-11th -
2023.04.03
Other
Be Co-creative, and Let’s Achieve Reform Together
—President Takahashi sends message at the first company entrance ceremony of Resonac — -
2023.03.08
Other
Resonac Wins the Grand Prix at NIKKEI Integrated Report Award 2022
— “Message from the top management” in our report obtained full marks in the screening process of the Award —
Topics
Products
Resonac makes the most of its technologies pertaining to inorganic, metal, and organic chemistry, and provides individualized products for various fields including energy, environment, information, and electronics industries.
Solutions
We in Resonac propose various effective solutions for the problem-solving in manufacturing and technology development.
- Solution
Resonac’s primer achieves both low dielectric properties and high adhesion to low-roughness copper foil. Used as an adhesive between substrates and low-roughness copper foil, our SFR reduces transmission loss on the circuit substrates for communication terminals and base stations in 5G communication and other high frequency bands.
- Technical Commentary
This article explains what ACF stands for, its purposes, how to use, types, and the key points and basic knowledge in choosing the appropriate ACF; it also provides information about RESONAC’s ACF “ANISOLM,” a useful solution to delamination.
- Solution
Used as a sealing material primer, "HIMAL" increases adhesion between the lead frame, semiconductor devices or wires and the sealing material, and reduces internal stress. The reliability of power semiconductors is improved by raising the sealing material’s heat resistance while preventing delamination.
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To be a Co-creative Chemical Company
We are committed to co-creating a better society together with stakeholders who share our ideas, ranging from consumers to industry leaders.
As a "Co-creative Chemical Company," Resonac will "Change society through the power of chemistry."
Sustainability
Resonac promotes innovations through cooperation and co-creation with its customers and partners, thereby achieving the newly integrated company’s Purpose: “Change society through the power of chemistry.”
