Dicing Die Bonding Film
FH/HR Series
About the product
Resonac’s die attach films (DAF) combine function of dicing tapes and die bonding films suitable for semiconductor wafer singulation and bonding process.
Resonac has marketed its DAF for more than 20 years and leads the world in production volume and sales.
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Merits
- Contributes to the reliability of semiconductor packages using DAF technology that provides low elasticity with excellent thermal stress relaxation, high adhesive strength, and superior heat resistance.
- Wide variety of products for applications from 3D NAND and DRAM memory devices to lead frames.
- Film thickness from ultra-thin types to thick types for FOW(film over wire) and FOD(film over die) applications.
- High Elastic modulus for good wire bondability of small chip
- Suitable for new processes such as SDBG (Stealth Dicing Before Grinding), in addition to conventional blade dicing
- Excellent thermosetting adhesive film technology is used to expand various applications.
Offer DAF singe layer products for electronic components and modules.
Characteristics
| Product name | FH-9011 | HR-9004 | HR-900-N50 | HR-900-N45 | HR-300-S34 | FH-4013 | HR-400-N45 | FH-SC13 | HR-5104 | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Application | Die/sub.,die/die Blade Expansion | Die/sub., die/die Blade | Die/sub., die/die Blade Anti-ESD | Die/sub., die/die Expansion | Die/sub, die/die Blade | FOD Blade | FOW Expansion | Small die Blade | Small die Blade | |||||
| Film thickness lineup | 10,20,25 (12 inch) 20,25 (8 inch) | 10,20,25(12 inch) 20,25(8 inch) | 10,15,20(12 inch) | 7,10,15,20(12 inch) | 10, 20, 25(12 inch) | 120(12 inch) | 50,60(12 inch) | 10,25(8 inch) | 10,25(12 inch) 10,25(8 inch) | |||||
| Dicing tape properties | ||||||||||||||
|
Peel strength between DAF and DCT |
Before UV | N/25mm | 1.37 | 0.2 | 0.68 | 0.9 | 0.23 | 0.93 | 0.75 | 1.02 | 0.25 | |||
| After UV | N/25mm | 0.04 | 0.1 | 0.05 | 0.07 | 0.06 | 0.04 | |||||||
| DAF type | 900 series | 300 series | 400 series | 510 series | ||||||||||
| DAF properties | ||||||||||||||
| Glass transition temperature | ºC | 177 | 171 | 130 | 157 | |||||||||
| Elastic modulus | -55℃ | MPa | 3000 | 3700 | 4800 | 8000 | ||||||||
| 0℃ | MPa | 2300 | 2900 | 4100 | 6800 | |||||||||
| 25 ℃ | MPa | 600 | 840 | 2700 | 4500 | |||||||||
| 50 ℃ | MPa | 13 | 6 | 1300 | 2100 | |||||||||
| 100 ℃ | MPa | 4 | 1 | 980 | 1200 | |||||||||
| 150 ℃ | MPa | 3 | 1 | 47 | 730 | |||||||||
| 200 ℃ | MPa | 2 | 1 | 25 | 96 | |||||||||
| 250 ℃ | MPa | 2 | 1 | 29 | 110 | |||||||||
| CTE | α1 | ppm/℃ | 144 | 185 | 96 | 84 | ||||||||
| α2 | ppm/℃ | 186 | 217 | 176 | 155 | |||||||||
| Dissipation factor | 1 kHz | - | 0.06 | 0.06 | 0.02 | 0.02 | ||||||||
| 1 MH | - | 0.03 | 0.03 | 0.02 | 0.02 | |||||||||
| Dielectric Constant | 1 kHz | - | 4.4 | 4.6 | 4.4 | 4.3 | ||||||||
| 1 MH | - | 3.7 | 3.9 | 4 | 3.9 | |||||||||
| Ionic impurity | Cl- | ppm | 0 | 0 | 0 | 0 | ||||||||
| Thermal conductivity | W/mK | 0.2 | 0.2 | 0.3 | 0.5 | |||||||||
*The data in this table are representative values and do not guarantee quality. The values are subject to change without notice due to the optimization of measurement conditions or other reasons.
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