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Solution

We in Resonac propose various effective solutions for the problem-solving in manufacturing and technology development.

Solution NEW Closing the Carbon Gap: The Quantifiable Emissions Advantage of Biomass PE Over Petroleum Resonac proposes biomass-derived polyethylene sheets as a key solution for CO₂ reduction. These sheets offer physical properties and processability equivalent to petroleum-based products, contributing to a lower carbon footprint throughout the entire product lifecycle. Others Environmentally friendliness
Solution NEW Flake-Shaped Boron Nitride (BN) Filler for High-Thermal-Conductivity Compounds Resonac’s proprietary surface-treated flake-shaped boron nitride filler enables higher loading in resins, delivering superior thermal conductivity while maintaining processability with reduced viscosity. Semiconductor/Electronic materials Power semiconductor Thermal Management Heat dissipation properties Electrical insulation
Solution NEW Automotive Plastic Gears Reduce Gear Meshing Vibration and Noise with High Damping Performance This plastic gear is manufactured using a vacuum injection molding process, combining high-heat-resistant polyaminoamide resin with aramid reinforcing fibers. The resin matrix effectively damps vibrations, leading to a significant reduction in noise. Automotive materials Noise reduction
Solution NEW Power Transmission Gears Enabling Noise Reduction and Lightweight Design for Industrial Robots By using palstic with a lower elastic modulus than steel, vibration and noise during gear meshing are effectively reduced. Furthermore, it achieves significant weight reduction while maintaining high gear strength. Automotive materials Industrial use Noise reduction
Column NEW Materials Contributing to Warpage Mitigation & Stress Relief in Advanced Semiconductor Packages (1) Learn how to address warpage in advanced semiconductor packaging. We introduce Resonac’s high-modulus, low-CTE package substrate materials and low-CTE, low-cure-shrinkage solder resists. Semiconductor/Electronic materials
Column Materials Contributing to Thermal Management in Advanced Semiconductor Packaging (2) For effective thermal countermeasures in advanced semiconductor packages, reducing interfacial thermal resistance and achieving higher thermal conductivity through the proper use of capillary underfill and die-attach films is essential. Semiconductor/Electronic materials
Solution Reducing Transmission Loss in High-Frequency FPCs with Low-Dk, Low-Df Substrates Higher frequency communication requires low Dk/Df substrate materials. Resonac’s polyimide resin reduces transmission loss and improves dimensional stability with low Dk/Df and CTE close to Cu. Semiconductor/Electronic materials 5G Millimeter wave Low dielectric/High frequency
Solution PCBN for Cutting Tools with Wide Range of Hardness - From Cast Iron, Sintered Alloys to Hardened Steel PCBN offers an excellent balance of wear and fracture resistance for cutting tools used to machine materials from cast iron to hardened steel. It is ideal for workpieces with mixed or varying materials, enabling stable automated machining. Automotive materials Industrial use Environmentally friendliness Productivity improvement
Column Materials Contributing to Thermal Management in Advanced Semiconductor Packaging (1) Effective thermal countermeasures for advanced semiconductor packages include the use of appropriate thermal interface materials (TIMs) and epoxy molding compounds (EMCs) that help reduce contact thermal resistance and enhance overall thermal conductivity. Semiconductor/Electronic materials
Column Technical Challenges in Advanced Semiconductor Packaging Key technical challenges in 3D packaging include thermal management, warpage, increased manufacturing complexity and cost, and defect detection. Each of these issues can be effectively addressed through design and process optimization, as well as the use of appropriate materials. Semiconductor/Electronic materials
Column Manufacturing Processes and Materials Used in Advanced Semiconductor Packaging A comprehensive guide to the manufacturing processes of advanced semiconductor packages—from interposer formation to assembly on the package substrate—along with the materials used in each step. Semiconductor/Electronic materials
Column Structure of Advanced Semiconductor Packages A comprehensive explanation of the structure and benefits of 2.5D and 3D packages, which are gaining attention with the rise of AI. How does high chip integration enable higher performance, smaller form factors, and lower power consumption? Semiconductor/Electronic materials
Column The Evolution of Semiconductor Packaging As the limits of semiconductor miniaturization become apparent, packaging technology is increasingly recognized as a key driver for performance improvement. In this article, we explain how semiconductor packaging has evolved—from lead-frame packages in the 1970s to today’s cutting-edge 3D packages. Semiconductor/Electronic materials
Solution Improve flexibility of heat dissipation design for power devices’ embedded substrates Resonac’s photosensitive interlayer insulation film PV-F enables the formation of large cavities and numerous fine-pitch vias through photolithography. Semiconductor/Electronic materials Power semiconductor Thermal Management High integration Miniaturization Productivity improvement Heat dissipation properties
Solution PCBN extending interrupted cutting tools’ life
with both hardness and fracture resistance Resonac’s PCBN is sintered material with both hardness and fracture resistance. It contributes to extend tool life by reducing occurrence of sudden chipping during lathe machining of stiff objects. Others Industrial use
Solution RF Module Substrate with Low Dk, Low Df, and Low CTE,
Ideal for Multilayering and Miniaturization Resonac’s RF module substrate “HS20N (D)” features low Dk, low Df, low CTE, and high Tg. With a lower Dk than conventional models, this can be thinned and multilayered to realize smaller modules. Semiconductor/Electronic materials 5G Millimeter wave High integration Miniaturization Low dielectric/High frequency
Solution Low-Melting Glass “Vaneetect”
Enabling Reliable Hermetic Sealing by Heating at 300°C Resonac’s low-melting glass contains no substances restricted by the EU’s RoHS Directive and enables sealing at low temperatures, thereby contributing to reduced energy consumption in manufacturing of vacuum insulated glass. Others Adhesion/Bonding Environmentally friendliness
Solution Reliability Surpassing Sintered Silver!
Sintered Copper Paste with 300W/m・K Thermal Conductivity Resonac’s sintered copper paste is suitable for efficient, high-output, miniaturizable SiC modules. It allows better reliability than sintered silver, while having equivalent thermal conductivity. Semiconductor/Electronic materials Power semiconductor xEV Adhesion/Bonding Thermal Management Heat dissipation properties
Solution The Al cooler enabling higher output, downsizing and weight reduction of power modules Resonac proposes a heatsink/cooler that meets both demand for effective cooling of xEV inverters’ power modules and requirements for reducing their size and weight, according to customer specifications. Automotive materials Power semiconductor xEV Miniaturization Weight reduction
Solution Enhancing the reliability of power semiconductors!
High Tg, Heat-Resistant Epoxy Molding Compounds Resonac’s heat-resistant epoxy molding compounds feature high Tg, restrain decomposition, prevent delamination, and relax stress, improving reliability test with optimally balanced materials. Semiconductor/Electronic materials Power semiconductor Heat resistance
Solution 77 GHz radar substrate material with excellent RF performance, processability, and reliability Resonac’s LW-990(RFD) features excellent RF performance, processability, and reliability with a low CTE and low elastic modulus resin, meeting 77 GHz radar substrate through precision miniaturization. Automotive materials Millimeter wave Sensor High integration Miniaturization Low dielectric/High frequency
Solution HIMAL prevents delamination of a power semiconductor’s sealing material and improves reliability Used as a sealing material primer, "HIMAL" increases adhesion between the lead frame, semiconductor devices or wires and the sealing material, and reduces internal stress. The reliability of power semiconductors is improved by raising the sealing material’s heat resistance while preventing delamination. Semiconductor/Electronic materials Power semiconductor Stress relaxation Electrical insulation
Solution Achieving both low dielectric properties and high adhesion to copper foil!
Primer for millimeter wave circuit substrates Resonac’s primer achieves both low dielectric properties and high adhesion to low-roughness copper foil. Used as an adhesive between substrates and low-roughness copper foil, our SFR reduces transmission loss on the circuit substrates for communication terminals and base stations in 5G communication and other high frequency bands. Semiconductor/Electronic materials 5G Millimeter wave Low dielectric/High frequency
Thorough Explanation What is ACF (Anisotropic Conductive Film)?
Its usages, how to apply, types, and more are explained. This article explains what ACF stands for, its purposes, how to use, types, and the key points and basic knowledge in choosing the appropriate ACF; it also provides information about RESONAC’s ACF “ANISOLM,” a useful solution to delamination. Semiconductor/Electronic materials High integration Miniaturization
Solution High reliability die bonding paste for total cost reduction Die bonding material with low elasticity, excellent stress relaxation, and high adhesive strength. Reliable die bonding can be achieved without additional cost. Semiconductor/Electronic materials Stress relaxation
Solution High relative permittivity materials for transfer molding It is a high dielectric constant molding material with excellent workability. Due to its low dielectric loss tangent, it exhibits excellent transmission performance even in high frequency bands. Semiconductor/Electronic materials 5G Millimeter wave Miniaturization Low dielectric/High frequency
Thorough Explanation 【Thorough Explanation】What are transmission loss, dielectric loss, and dielectric loss tangent? High-frequency transmission loss is a growing challenge due to increased data via IoT, 5G, ADAS, and AI. This article explains the causes and the reduction methods of transmission loss on PCBs. Semiconductor/Electronic materials 5G Low dielectric/High frequency
Solution Precision 3D Printing Using Curable Monomers "FANCRYL" <500 series> has a bulky DCPD structure that it contributes to low cure shrinkage when added to 3D print resin formulations. Others Industrial use
Solution A heat-resistant binder resin that conforms to REACH regulations Binder resin that does not use REACH regulated substances. It has the same high heat resistance and mechanical properties as conventional PAI resin. Automotive materials Battery material Environmentally friendliness Heat resistance NMP-free
Solution Binder for lithium-ion batteries contributing to higher capacity A binder that uses polyamide-imide resin with excellent coating film strength. Contributes to improving the cycle characteristics of lithium-ion batteries. Automotive materials Battery material
Solution Crosslinking agent for preventing degradation of rubber products A cross-linking agent that improves the heat resistance and tensile strength of butyl rubber. Productivity improvement in tire manufacturing can be expected. Automotive materials Productivity improvement Heat resistance
Solution Separators’ heat-resistant coating binder that improves LIB safety Resonac’s PNVA binder demonstrates thermal resistance that satisfies safety requirements of LIBs. The binder also enables a thin ceramic coating on separators, which increases the LIBs’ capacity. Automotive materials xEV Battery material Heat resistance
Solution A film capable of bonding a low heat-resistant circuit board It is possible to connect a circuit board with low heat resistance. Because the thickness is several tens of micrometers, it contributes to the thinning of connection parts. Semiconductor/Electronic materials Miniaturization

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