Liquid Encapsulant for Flip Chip Package Underfill
CEL-C Series
About the product
Resonac’s liquid encapsulant fills the gap between chip and substrate and protects solder bumps and substrates of Flip Chip Package.
The product enjoys a large market share worldwide.
![Image of CEL-C Series](/sites/default/files/2022-11/001_24.jpeg)
Inquiry of this product
Merits
- Excellent moisture resistance and electrical insulation.
- Excellent reliability with high adhesion between various devices and substrates.
- Excellent flow-ability for narrow gap.
- Control substrate warpage with a low elastic modulus and expansion rate.
Characteristics
Inquiry of this product