Liquid Encapsulant for Flip Chip Package Underfill
CEL-C Series
About the product
Resonac’s liquid encapsulant fills the gap between chip and substrate and protects solder bumps and substrates of Flip Chip Package.
The product enjoys a large market share worldwide.
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Benefits
- Excellent moisture resistance and electrical insulation.
- Excellent reliability with high adhesion between various devices and substrates.
- Excellent flow-ability for narrow gap.
- Control substrate warpage with a low elastic modulus and expansion rate.
Characteristics
| Product name | CEL-C-3900 Series | CEL-C-3730 Series |
|---|---|---|
| Applications | COF (Underfill) |
FC-BGA (Underfill) |
| Features | Non-filler material with high impregnating ability and high migration resistance. | Excellent solder-reflow resistance and heat cycle resistance with high moisture-resistant adhesion and a thermal expansion coefficient matching that of solder bumps. |
| Curing condition | 120 °C/15 min+ 150 °C/1 h |
150 °C/2 h or 165 °C/2 h |
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