ACF (Anisotropic Conductive Film) for IC Chip Connections

AC Series

About the product

Resonac’s ACF for IC chips easily connects display panels and fine-pitch terminals, including driver ICs, with thermo-compression bonding.

Resonac pioneered this film material that combines thermosetting resins and conductive particles to achieve both conductive and insulative properties.

Interconnection between LCD and driver IC

Inquiry of this product


  • Reduces process costs with low-temperature, short-time thermo-compression bonding.
  • Capable of packaging low heat-resistant components that cannot be soldered.
  • Highly adhesive to reliably connect various types of display panels and substrates.


Item Unit AC-8000 series
Application IC chip
Fine pitch capability Minimum contact area μm2 600
Minimum space μm 10
Temperature ºC 140~
Time sec 5~
Pressure MPa 40~*
  • * Per total electrode area

Inquiry of this product