Copper Clad Laminates (CCL) & Prepregs for High-Frequency and High-Speed Transmission
About the product
Resonac’s copper clad laminates (CCL) and prepregs are ideally suited for high-capacity, high-speed signal transmission in applications such as AI servers, high-speed routers, and 5G/6G communication antennas. Their low-dielectric properties (low Dk/Df) effectively suppress insertion loss in high-frequency bands. We introduce our comprehensive lineup of printed wiring board materials that contribute to enhanced circuit design flexibility and higher system reliability.
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Benefits
- Low permittivity reduces transmission loss even in high-frequency circuits.
- Low thermal expansion realizes greater connection and insulation reliability.
- High thermal resistance.
- Product lineup with a low environmental load containing no halogen compounds.
Product Lineup
| Product name | Dk (10 GHz) | Df (10 GHz) | CTE (x,y) | CTE (z) | Tg |
|---|---|---|---|---|---|
| MCL-LW-990 (Type RFD) | 3.0 - 3.3 | 0.0020 - 0.0043 | 8 - 11 | 35 - 45 | 175 - 205 |
| MCL-HE-679G (Type S) | 3.6 - 3.8 | 0.007 - 0.009 | 12 - 17 | 30 - 40 | 180 - 190 |
| MCL-HS20N | 3.2 - 3.4 | 0.0020 - 0.0030 | 8 - 10 | 25 - 35 | 220 - 240 |
GH-200 (Type D) |
3.2 - 3.4 | 0.0020 - 0.0030 | 8 - 10 | 25 - 35 | 220 - 240 |
| MCF-200HS | 2.9 - 3.1 | 0.0030 - 0.0040 | 35 - 40 | ‐ | 250 - 270 |
| MCL-I-671 | 4.1 - 4.3 | 0.0130 - 0.0150 | 12 - 15 | 50 - 80 | 200 - 215 |
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