MCL-LW-900G/910G

Halogen Free, High Tg, Low Transmission Loss Multilayer Material

About the product

  • Product 
    CCL

    MCL-LW-900G/910G

    Prepreg

    GWA-900G/910G

  • Applications
    • High-speed computer, server
    • High-speed router
    • High frequency devices, antenna

Inquiry of this product

Inquiry form

Features

  • MCL-LW-910G achieved low dielectric constant (3.3 at 10 GHz) and low dissipation factor (0.0028 at 10 GHz) using low Dk glass and HVLP copper.
  • Enables high-speed transmission/communication at 25 Gbps by low transmission loss properties.
  • Has excellent heat resistance and connection reliability.

Characteristics

Dielectric characterization results

Dielectric characterization results
Dielectric characterization results
Measurement Conditions
  • Method: Triplate-Line Resonator (JPCA-TM001)
  • Temperature & Humidity: 25℃/60%RH
  • Laminate Thickness (b): 1.6 mm (Signal-Ground: 800 µm), Trace thickness(t): 18 µm (RT, HVLP)
  • Signal Conductor Line Width(w): 1 mm (Zo: ca.50 Ω)
Measurement Conditions

Transmission Loss

Measurement conditions
  • Evaluation PWB: Strip-line
  • Temperature & Humidity: 25℃/60%RH
  • Characteristic impedance: Approx. 50 Ω
  • Inner layer surface treatment: Black-reduction
  • Proofreading method: TRL (Thru-Reflect-Line)
  • Trace width(w): 0.120 mm
  • Dielectric thickness(b): 0.25 mm
  • Trace thickness(t): 18 µm
Transmission Loss
Transmission Loss

Copper Clad Laminate

                                                                                                                                                                                                              (t0.8 mm)

Item Condition※3 Unit Actual Value Reference
(IPC-TM-650)
MCL-LW-900G MCL-LW-910G
Tg TMA method A ℃ 190–210 2.4.24
DMA method A 220–260 ‐
CTE ※1 X (30–120℃) A ppm/℃ 12–15 ‐
Y (30–120℃) 12–15
Z (＜Tg) A 35–45 2.4.24
(＞Tg) A 230–280
Solder Heat Resistance (260℃) A sec. ≧300 ‐
T-260 (Without Copper) A min. ≧60 2.4.24.1
T-288 (Without Copper) ≧60
Decomposition Temperature (TGA method 5% Weight Loss) A ℃ 410–450 2.3.40
Copper Peel Strength 18 µm RT A kN/m 0.4–0.7 2.4.8
18 µm HVLP 0.4–0.7
Flexural Modulus (Lengthwise) A GPa 16–21 2.4.4
 Dielectric Constant 10 GHz ※2 A － 3.6–3.8 3.2–3.4 IEC-62810
 Dissipation Factor 10 GHz ※2 A － 0.0040–0.0050 0.0025–0.0035
Volume Resistivity C-96/40/90 Ω･cm 1×1014–1×1016 2.5.7
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016 ‐
D-2/100 1×1012–1×1014 ‐
  • ※1 Heating Rate: 10℃/min.(Comp.)
  • ※2 Measured by Cavity Resonator.
  • ※3 Refer to"Condition Note"PDFを開く
  • ※ Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-LW-900G
(E glass)

MCL-LW-910G
(Low Dk glass )		 ̶ 18 µm
35 µm
70 µm
(RT)

12 µm
18 µm
35 µm
(HVLP)		 M0.05 0.05mm
M0.06 0.06mm
M0.08 0.08mm
0.1 0.10mm
M0.11 0.10mm
0.13 0.13mm
M0.15 0.15mm
0.2 0.20mm
0.26 0.25mm
  • Note1) Laminate thickness means dielectric layer thickness.

Prepreg 

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination ※1 
GWA-900G 0.05 (1037N72) 1037 72±2 0.050 mm
0.06 (1078N64) 1078 65±2 0.078 mm
0.08 (3313N57) 3313 57±2 0.106 mm
0.1 (2116N55) 2116 55±2 0.125 mm
GWA-910G 0.05 (1037N74) 1037 74±2 0.050 mm
0.06 (1078N67) 1078 67±2 0.078 mm
0.08 (2013N59) 2013 59±2 0.106 mm
0.1 (2116N57) 2116 57±2 0.125 mm
Reference (IPC-TM-650) 2.3.16 ‐
  • ※1 The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
  •     Values change depending on the press condition or inner layer pattern.

Inquiry of this product

Inquiry form