Standards (UL Standard / BS Standards)

UL Standards

Base Material Recognition File No. E80148

Part Number ANSI Min.
Thickness
(mm)
Max.
Thickness
(mm)
UL 94
Flame
Class
TI ※1 PLC DSR
Elec Mech HWI ※1 HAI ※1 HVTR ※1 CTI
MCL-I-671 GPY 0.03 1.6 V-0 170 180 0 0 3 4 YES
MCL-HE-679G FR-4.1 0.03 1.6 V-0, VTM-0 130 140 0 0 - 2 YES
MCL-E-700G - 0.02 0.62 V-0, VTM-0 180 180 3 0 - 0 YES
MCL-E-770G - 0.10※2 0.81 V-0 170 140 0 0 - 1 YES
MCL-E-795G - 0.02 1.6 V-0,
VTM-0
160 160 0 0 - 0 YES
MCL-LW-990 - 0.04 1.6 V-0, VTM-0 50 50 0 0 - 1 YES
  • *1)Data above are based on unclad laminates, and the properties may vary depending on the board thickness. TI : Temperature Index(°C)
    HWI : Hot Wire Ignition(PLC)
    HAI : High-current Arc Ignition(PLC)
    HVTR : High-voltage-arc Tracking Rate
    CTI : Comparative Tracking Index(PLC) *2)Min. laminate and prepreg sheet thicknesses in multilayer PWBs are 0.02 mm.
  • Hot Wire Ignition Performance Level Categories

    Range - Mean Ignition Time (s) Assigned PLC
    120 ≤ IT
    0
    60 ≤ IT < 120
    1
    30 ≤ IT < 60
    2
    15 ≤ IT < 30
    3
    7 ≤ IT < 15
    4
    0 ≤ IT < 7
    5

    High-voltage Arc-tracking-rate Performance Level Categories

    Rang - Tracking Rate (mm/min) Assigned PLC
    0 < TR ≤ 10
    0
    10 < TR ≤ 25.4
    1
    25.4 < TR ≤ 80
    2
    80 < TR ≤ 150
    3
    150 < TR
    4

    High Ampere Arc Ignition Performance Level Categories

    Range - Mean Number of Arcs to Cause Ignition (NA) Assigned PLC
    120 ≤ NA
    0
    60 ≤ NA < 120
    1
    30 ≤ NA < 60
    2
    15 ≤ NA < 30
    3
    0 ≤ NA < 15
    4

    Comparative Tracking Performance Level Categories

    Range - Tracking Index (Volts) Assigned PLC
    600 ≤ TI
    0
    400 ≤ TI < 600
    1
    250 ≤ TI < 400
    2
    175 ≤ TI < 250
    3
    100 ≤ TI < 175
    4
    0 ≤ TI < 100
    5

    Please refer to UL Product iQ for details.

    MCIL Recognition  File No. E80148

    Part Number ANSI

    Min.
    Thickness
    (mm)

    UL
    Flame
    Class
    Clad Conductive Thickness(µm) Max.
    Area
    Diameter
    (mm)
    Solder Limit Assembly Solder Process(*) Max.
    Operating
    Temperature
    (°C)
    Solder Process Solder Limits
    Min. Max. Tempe- rature
    (°C)
    Time
    (s)
    Temp.
    (°C)
    Cycles Temp.
    (°C)
    Time
    (s)
    MCL-HE-679G FR-4.1 0.17 V-0 3 35 50.8 ※2 - ー ー ー 120
    0.20 V-0 3 35 50.8 ※2 - ー ー ー 130
    0.38 V-0 3 70 50.8 ※2 ー ー ー ー 130
    0.12 V-0 3

    35

    50.8 ー 260 6 288 30 120
    0.22 V-0 3

    35

    50.8 ー 260 6 288 30 130
    0.38 V-0 3 70 50.8 ー 260 6 288 30 130
    MCL-I-671 GPY 0.20 V-0 5 105 50.8 ※1 ー ー ー ー 130

    Certified condition may vary depending on the board thickness. (※)Double sided.

    • *1: 230 °C/60 min + 260 °C/2 min + 260 °C/20 sec. *2: 230 °C/40 min + 250 °C/2 min + 288 °C/30 s
    • (*)Assembly solder process evaluated to IPC-TCM-650,2.6.27 Thermal Stress Assembly Simulation.
    • BS Standards

      Certificate No. Part Number Flammability category Min. Thickness (mm)
      VC643585 MCL-I-671 V-0 0.10