Standards
UL Standards
Base Material Recognition File No. E80148
- *1)Data above are based on unclad laminates, and the properties may vary depending on the board thickness. TI : Temperature Index(℃), HWI : Hot Wire Ignition(PLC), HAI : High-current Arc Ignition(PLC), HVTR : High-voltage-arc Tracking Rate, CTI : Comparative Tracking Index(PLC) *2)Min. laminate and prepreg sheet thicknesses in multilayer PWBs are 0.02 mm.
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Hot Wire Ignition Performance Level Categories
High-voltage Arc-tracking-rate Performance Level Categories
High Ampere Arc Ignition Performance Level Categories
Comparative Tracking Performance Level Categories
Please refer to UL Product iQ for details.
MCIL Recognition File No. E80148
Certified condition may vary depending on the board thickness. (※)Double sided.
- *1: 230℃/40min. + 250℃/40sec. + 260℃/20sec. *2: 230℃/60min. + 260℃/2min. + 260℃/20sec. *3: 230℃/40min. + 250℃/2min. + 288℃/30sec.
- (*)Assembly solder process evaluated to IPC-TCM-650,2.6.27 Thermal Stress Assembly Simulation.
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BS Standards