MCL-HD60/HD90

High Dk Multilayer Material

About the product

  • Product
    CCL

    MCL-HD60/HD90

    Prepreg

    GD-60/GD-90

  • Applications
    • Antenna-in-package

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Features

  • Enables miniaturization and higher antenna gain of antenna-in-package.
  • High Dk and low Df substrate material.
  • High Dk with low transmission loss.
  •  Excellent reliability (heat resistance, insulation, connection)

Characteristics

Antenna size simulation

 

Mounting warpage characteristic evaluation results

　　　

Sample Construction（ Substrate： 14mm × 14 mm)
・E-705G(1037, 60 μm) x 3 ply
・HS200(Type D)(1037, 60 μm) x 3 ply
・HD60 (1037, 60 μm) x 3 ply
・Copper foil： 3 μm, 65%
・Solder resist： 20 μm (SR-FA)

TEG Chip
・Chip size： 10 mm×10 mm
・Chip thickness： 100 μm
・Chip bump： N/A (Gap:60 μm)
・Underfill： CEL-C-3730 series

HD60 Warpage graph

Heat resistance test results (reflow resistance test)

Test sample:4L construction, 35 mm x 35 mm

L1,L4 copper thickness : 1.5 μm

L2,L3 copper thickness : 18 μm    Cu Coverage：15-90% 　surface treatment: CZ8401      

Test Condition

Condition1

Pre-condition：144 hrs 60℃/60% RH

Test condition：260 ℃ reflow x 30 times

Condition2

Pre-condition：PCT-4 hrs

Test condition：260 ℃ reflow x 5 times

Item #1 #2 #3 #4
Construction Core HS200(Type D) HD60 HS200(Type D) HD60
Reflow
resistance		 60℃/60%RH 144h 30 pass 30 pass 30 pass 30 pass
PCT-4h 5 pass 5 pass 5 pass 5 pass

Characteristics

Copper Clad Laminate

Item Unit Actual value
HD60 HD90 HD90(Type D)
Glass cloth Glass type ー

E

E

Low Dk
Style

2116

3313

3313
Tg DMA ℃

240

240

240
CTE XY ※1 ppm/℃

11.0

12.0

12.0
Copper Peel Strength 12 μm (VLP) kN/m

0.6

0.5

0.5
Elastic Modulus GPa

18

15

14
Dielectric Constant

10 GHz※2

ー

6.2

9.2

8.6
20 GHz※2

6.2

9.2

8.6
36 GHz※2

6.2

9.2

8.6
50 GHz※2

6.2

9.2

8.6
60 GHz※2

6.2

9.2

8.6
Dissipation Factor

10 GHz※3

 ー

0.0056

0.0050

0.0038
20 GHz※3

0.0062

0.0060

0.0042
36 GHz※3

0.0074

0.0072

0.0050
50 GHz※3

0.0080

0.0075

0.0056
60 GHz※3

0.0080

0.0075

0.0060
  • ※1 Heating Rate: 10℃/min. (Tensile)
  • ※2 SPDR method, Drying:105℃ / 1h
  • ※3 Cut-off circular waveguide method, Drying:105℃ / 1h.
  • ※ Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

 
Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-HD60 ー 1.5,2,3,12 μm(LP)
12, 18, 35 μm(HVLP)		 0.1 0.10 mm
0.21 0.20 mm
0.24 0.24 mm
0.31 0.30 mm
0.41 0.40 mm
MCL-HD90 ー 1.5,2,3,12 μm(LP)
12, 18, 35 μm(HVLP)		 0.1 0.10 mm
0.15 0.15 mm
0.21 0.20 mm
0.31 0.30 mm
0.41 0.40 mm
0.45 0.45 mm
(D)
0.1 0.10 mm
0.15 0.15 mm
0.21 0.20 mm
0.31 0.30 mm
0.41 0.40 mm
0.45 0.45 mm

Note 1)  LP/HVLP: Low profile copper foil.Note 2)  Laminate thickness means dielectric layer thickness.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content（％）

Dielectric Thickness

after Lamination *1
GD-60 ー 0.025 1017F80 1017 80±2 0.031 mm
1017F88 88±2 0.053 mm
0.030 1027F74 1027 74±2 0.038 mm
1027F82 82±2 0.056 mm
0.040 1037F76 1037 76±2 0.050 mm
1037F85 85±2 0.081 mm
0.060 1078F67 1078 67±2 0.070 mm
1078F76 76±2 0.098 mm
GD-90 ー 0.025 1017F82 1017 82±2 0.034 mm
1017F90 90±2 0.063 mm
0.030 1027F74 1027 74±2 0.037 mm
1027F82 82±2 0.055 mm
0.040 1037F74 1037 74±2 0.045 mm
1037F82 82±2 0.066 mm
0.060 1078F68 1078 68±2 0.071 mm
1078F76 76±2 0.096 mm
(D) 0.025 1017F84 1017 84±2 0.036 mm
1017F92 92±2 0.073 mm
0.030 1027F76 1027 76±2 0.037 mm
1027F84 84±2 0.056 mm
0.040 1037F76 1037 76±2 0.043 mm
1037F84 84±2 0.066 mm
0.060 1078F70 1078 70±2 0.070 mm
1078F78 78±2 0.097 mm
  • *1)The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.　Values change depending on the press condition or inner layer pattern.

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