MCL-HD60/HD90

High Dk Multilayer Material

About the product

  • Product
    CCL

    MCL-HD60/HD90

    Prepreg

    GD-60/GD-90

  • Applications
    • Antenna-in-package

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Features

  • Enables miniaturization and higher anntena gain of antenna-in-package.
  • High Dk and low Df substrate material.
  • High Dk with low transmission loss.
  •  Excellent reliability (heat resistance, insulation, connection)

Characteristics

Antenna size simulation

 

Mounting warpage characteristic evaluation results

　　　
Test sample （Substrate： 14mm × 14 mm)
TEG Chip
  • Chip size：10 mm×10 mm
  • Chip thickness：100 μm
  • Chip bump：N/A (Gap:60 μm)
  • Underfill ：CEL-C-3730 series
 
HD60 Warpage graph

Heat resistance test results (reflow resistance test)

Test Size : 35 mm x 35 mm

L1,L4 copper thickness : 1.5 μm

L2,L3 copper thickness : 18 μm               Cu Coverage ：15-90 %                surface treatment ：CZ8401

Test Condition

Condition1

Pre-condition：144 hrs 60 ℃/60 % RH

Test condition：260 ℃ reflow x 30 times

Condition2

Pre-condition：PCT-4 hrs

Test condition：260 ℃ reflow x 5 times

 

Item

#1

#2

#3

#4

Construction

Prepreg(A)

GH-200(Type D)

GH-200(Type D)

GD-60

GD-60

Core

HS200(Type D)

HD60

HS200(Type D)

HD60

Prepreg(B)

GH-200(Type D)

GH-200(Type D)

GD-60

GD-60

Reflow
resistance

60 oC/60RH

144h

30 pass

30 pass

30 pass

30 pass

PCT-4h

5 pass

5 pass

5 pass

5 pass

Characteristics

Resin Coated Copper

Item Unit Actual value
HD60 HD90 HD90(Type D)
Glass cloth Glass type ー

E

E

Low Dk
Style

2116

3313

3313
Tg DMA ℃

240

240

240
CTE XY ※1 ppm/℃

11.0

12.0

12.0
Copper Peel Strength 12 μm (VLP) kN/m

0.6

0.5

0.5
Elastic Modulus GPa

18

15

14
Dielectric Constant

10 GHz※2

ー

6.2

9.2

8.6
20 GHz※2

6.2

9.2

8.6
36 GHz※2

6.2

9.2

8.6
50 GHz※2

6.2

9.2

8.6
60 GHz※2

6.2

9.2

8.6
Dissipation Factor

10 GHz※3

 ー

0.0056

0.0050

0.0038
20 GHz※3

0.0062

0.0060

0.0042
36 GHz※3

0.0074

0.0072

0.0050
50 GHz※3

0.0080

0.0075

0.0056
60 GHz※3

0.0080

0.0075

0.0060
  • ※1 Tensile method.
  • ※2 SPDR method, Drying:105 ℃ / 1h
  • ※3 Cut-off circular waveguide method, Drying:105 ℃ / 1h.
  • ※ Above data are experimental results and not guaranteed.

Standard Specifications

Resin Coated Copper

 
Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-HD60 ー 1.5,2,3,12 μm(VLP)
12, 18, 35 μm(HVLP)		 0.1 0.10 mm
0.21 0.20 mm
0.24 0.24 mm
0.31 0.30 mm
0.41 0.40 mm
MCL-HD90 ー 1.5,2,3,12 μm(VLP)
12, 18, 35 μm(HVLP)		 0.1 0.10 mm
0.15 0.15 mm
0.21 0.20 mm
0.31 0.30 mm
0.41 0.40 mm
0.45 0.45 mm
(D)
0.1 0.10 mm
0.15 0.15 mm
0.21 0.20 mm
0.31 0.30 mm
0.41 0.40 mm
0.45 0.45 mm
  • ※1) Std: Standard copper foil, LP/HVLP: Low profile copper foil.
  • ※2) The thickness means that of dielectric layer.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content（％）

Dielectric Thickness

after Lamination *1(mm)
GD-60 ー 0.025 1017F80 1017 74±2 31
1017F84 84±2 40
1017F88 88±2 53
0.030 1027F74 1027 74±2 38
1027F78 78±2 45
1027F82 82±2 56
0.040 1037F76 1037 76±2 50
1037F79 79±2 57
1037F82 82±2 67
1037F85 85±2 81
0.060 1078F67 1078 67±2 70
1078F70 70±2 77
1078F73 73±2 87
1078F76 76±2 98
GD-90 ー 0.025 1017F82 1017 82±2 34
1017F86 86±2 44
1017F90 90±2

63
0.030 1027F74 1027 74±2 37
1027F78 78±2 44
1027F82 82±2 55
0.040 1037F74 1037 74±2 45
1037F78 78±2 53
1037F82 82±2 66
0.060 1078F68 1078 68±2 71
1078F72 70±2 81
1078F76 76±2 96
(D) 0.025 1017F84 1017 84±2 36
1017F88 88±2 48
1017F92 92±2 73
0.030 1027F76 1027 76±2 37
1027F80 80±2 45
1027F84 84±2 56
0.040 1037F76 1037 76±2 43
1037F80 80±2 52
1037F84 84±2 66
0.060 1078F70 1078 70±2 70
1078F74 74±2 82
1078F78 78±2 97
  • *1)The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0 %.

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