MCF-200HS
Low Transmission Loss, Low CTE Adhesive Film
About the product
- Product
- Copper Clad Film
-
MCF-200HS
- Applications
- Semiconductor packages. (FC-CSP,PoP,SiP)
- Thinner Module PWB
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Features
- Film material (copper clad film) that can achieve an insulation layer of 15 μm or less.
- Excellent dielectric properties, contributing to thinner insulation layer thickness and lower transmission loss.
- Excellent insulation properties.
Characteristics
Reliability test (Layer to layer)
- Sample: MCF-200HS Dielectric thickness : 20 μm
- Pre-treatment condition: JEDEC Level 2 (60℃/60 %RH 120 hr + 260℃ reflow 6 cycle)
- Evaluation condition: 130℃/85%RH, 6 V
Dielectric properties (Frequency drift)
- Sample: MCF-200HS Dielectric thickness: 20 μm
- Evaluation method:
5～20 GHz： SPDR
36～60 GHz： Circular Cut-off Waveguide method
Copper Clad Film
| Item | Conditon ※3 | Unit | Actual Value | Reference (IPC-TM-650) |
||
|---|---|---|---|---|---|---|
| MCF-200HS | ||||||
| Tg | DMA | A | ℃ | 250～270 | ‐ | |
| CTE ※1 | X(30～120℃) | A | ppm/℃ | 35～40 | - | |
| Y(30～120℃) | 35～40 | |||||
| Solder Heat Resistance (260℃) | A | sec. | ≧300 | ‐ | ||
| Copper Peel Strength | 3 μm | A | kN/m | 0.5～0.7 | 2.4.8 | |
| 12 μm (LP) | 0.5～0.7 | |||||
| Elastic Modulus (Tensile) | A | GPa | 5～7 | ‐ | ||
| Dielectric Constant | 10 GHz ※2 | A | － | 2.9～3.1 | - | |
| Dissipation Factor | 10 GHz ※2 | 0.003～0.004 | ||||
- ※1 Heating Rate: 10℃/min. (Tensile)
- ※2 Measured by Split post dielectric resonator (SPDR).
- ※3 Refer to"Condition Note"
- ※ Above data are experimental results and not guaranteed.
Standard Specifications
Copper Clad Film
| Part Number | Copper foil type | Dielectric thickness | ||
| MCF-200HS | 1.5, 3, 12μm (LP) | 15 ± 2 μm | ||
| 20 ± 2 μm | ||||
| 25 ± 2 μm | ||||
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