MCF-200HS
Low Transmission Loss, Low CTE Adhesive Film
About the product
- Product
- Resin Coated Copper
-
MCF-200HS
- Applications
- Semiconductor packages. (FC-CSP,PoP,SiP)
- Thinner Module PWB
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Features
- Film material (resin coated copper) that can achieve an insulation layer of 15 μm or less.
- Excellent dielectric properties, contributing to thinner insulation layer thickness and lower transmission loss.
- Excellent insulation properties.
Standard Specifications
Resin Coated Copper
- Sample: MCF-200HS Dielectric thickness: 20 μm
- Evaluation method:
5～20 GHz (SPDR)
36～60 GHz (Circular Cut-off Waveguide method)
Reliability test (Layer to layer)
- Sample: MCF-200HS Dielectric thickness : 20 μm
- Pre-treatment condition: JEDEC Level 2 (60 ℃/60 %RH 120 hr + 260 ℃ reflow 6 cycle)
- Evaluation condition: 130 ℃/85 %RH, 6 V
Characteristic
Resin Coated Copper
| Item | Conditon ※3 | Unit | Actual Value | Reference (IPC-TM-650) |
||
|---|---|---|---|---|---|---|
| MCF-200HS | ||||||
| Tg | DMA | A | ℃ | 250～270 | ‐ | |
| CTE ※1 | X(30～120 ℃) | A | ppm/℃ | 35～40 | - | |
| Y(30～120 ℃) | 35～40 | |||||
| Solder Heat Resistance (260 ℃) | A | sec. | ＞300 | ‐ | ||
| Copper Peel Strength | 3 μm | A | kN/m | 0.5～0.7 | 2.4.8 | |
| 12 μm (VLP) | 0.5～0.7 | |||||
| Elastic Modulus (Tensile) | A | GPa | 5～7 | ‐ | ||
| Dielectric Constant | 10 GHz ※2 | A | － | 2.9～3.1 | - | |
| Dissipation Factor | 10 GHz ※2 | 0.003～0.004 | ||||
- ※1 Heating Rate: 10 ℃/min. (Compression)
- ※2 Measured by Split post dielectric resonator (SPDR).
- ※3 Refer to"Condition Note"
- ※ Above data are experimental results and not guaranteed.
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