AS-400HS/MCF-400HS
Low Loss Adhesive Film
About the product
- Product
- Adhesive Film
-
AS-400HS
- Resin Coated Copper
-
MCF-400HS
- Applications
- Antenna use
- High-speed PCB
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Features
- Excellent dielectric properties (Low transmission loss)
- Adaptable to multi layer press process.
- Good adhesion to PTFE
- Adaptable to interlaminate connection by laser IVH
Standard Specifications
| Part Number | Actual Thickness | Carrier Film Thickness |
|---|---|---|
| AS-400HS | 25 µm, 50 µm, 65 µm | 50 µm (PET) |
| MCF-400HS | 25 µm, 50 µm, 65 µm | 12 µm, 18 µm (HVLP foil) |
Characteristics
Transmission Loss
-
Measurement Conditions
Transmission structure: Micro-strip-line
Temperature & Humidity: 25 ℃/40 %RH
Characteristic impedance: 50 Ω
Calibration method: TRL
Line width(w): 240–270 µm
Dielectric thickness(b): 100–130 µm
Copper thickness (t): 30 µm (include plating)
Cross section of laser-via
C-stage
| Item | Conditon ※3 | Unit | Actual Value | Reference (IPC-TM-650) |
||
|---|---|---|---|---|---|---|
| AS-400HS/MCF-400HS | ||||||
| Storage Modulus (DMA method: 25℃) | A | Gpa | 3–5 | ‐ | ||
| Tg (DMA method) | A | ℃ | 190–250 | ‐ | ||
| CTE ※1 | Z | (＜Tg) | A | ppm/℃ | 20–45 | 2.4.24 |
| (＞Tg) | A | 35–75 | ||||
| Solder Heat Resistance (260 ℃) | A | sec. | ＞300 | ‐ | ||
| Copper Peel Strength | 18 µm HVLP | A | kN/m | 0.45–0.60 | 2.4.8 | |
| Dielectric Constant | 10 GHz ※2 | A | － | 2.9–3.1 | IEC-62810 | |
| Dissipation Factor | 10 GHz ※2 | A | － | 0.0020–0.0030 | ||
- ※1 Heating Rate: 10 ℃/min. (Compression)
- ※2 Mesured by cavity resonator.
- ※3 Refer to"Condition Note"
B-stage
| Item | Conditon | Unit | Actual Value | Reference |
|---|---|---|---|---|
| Volatile Content | 180 ℃ 5 min. weight method | wt% | <2 | ‐ |
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