MCL-HS20N

Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material

About the product

  • Product
    CCL

    MCL-HS20N

    Prepreg

    GH-20N

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Applications

  • Semiconductor packages (FC-CSP, PoP, SiP)　
  • Thinner Module PWB

Benefits

  • MCL-HS20N has hybrid properties of package and high speed materials.
  • MCL-HS20N has low CTE value in X, Y directions and good dielectric property (Dk 3.7, Df 0.0040 at 10 GHz).
  • MCL-HS20N(Type D) achieved low dielectric constant (3.4 at 10 GHz) and low dissipation factor (0.0025 at 10 GHz) using low Dk glass.
  • Well-suited for build-up construction.

Characteristics

Warpage of 4 layer board

Warpage of 4 layer board

TEG Chip
  • Chip size 10 mm×10 mm
  • Chip thickness 100 µm
TEG Substrate
  • Package size 14 mm×14 mm
  • L1, 4: 12 µm Cu: 65 %, L2, 3No Copper SR: 18 µm
  • Core thickness: 45 µm
  • Prepreg thickness: 45 µm
 
HS20N 4層基板におけるそり評価結果

Transmission Loss

HS20N伝送損失評価結果

Measurement conditions

  • Evaluation PWB: Strip-line
  • Temperature and Humidity: 25 °C/60 %RH
  • Characteristic impedance: Approx. 50 Ω
  • Calibration method: TRL(Thru-Reflect-Line)
  • Trace width(w): 0.12 - 0.14 mm
  • Dielectric thickness(b): 0.65 mm
  • Trace thickness(t): 18 µm
Measurement conditions

Copper Clad Laminate

(t0.2, t0.4 mm)

Item Condition ※4 Unit Actual Value Reference
(IPC-TM-650)
MCL-HS20N MCL-HS20N (Type D)
Tg TMA method A °C 250 - 270 2.4.24
DMA method A 330 - 350 ‐
CTE X (30 - 120 °C) A ppm/°C 8 - 10 2.4.24.5※1
Y (30 - 120 °C) A 8 - 10
Z (<Tg) A 25 - 35 2.4.24※2
(>Tg) 140 - 200
Solder Heat Resistance (260 °C) A sec ≥300 ‐
T-260 (Without copper) A min ≥60 2.4.24.1
T-288 (Without copper) A ≥60
Decomposition Temperature
(TGA method 5 % weight loss)		 A °C 410 - 430 2.3.40
Copper Peel Strength 12 µm A kN/m 0.5 - 0.7 2.4.8
18 µm A 0.6 - 0.8
Surface Roughness (Ra) A µm 2 - 3 2.2.17
Flexural Modulus (Lengthwise) A GPa 17 - 22 2.4.4
Dielectric Constant※3 10 GHz A ‐ 3.8～4.0 3.4 - 3.6 IEC-61189-2
Dissipation Factor※3 10 GHz A ‐ 0.0040 - 0.0050 0.0020 - 0.0030
Volume Resistivity C-96/40/90 Ω⋅cm 1×1014 - 1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013 - 1×1015
Insulation Resistance C-96/20/65 Ω 1×1014 - 1×1016 ‐
C-96/20/65+D-2/100 1×1013 - 1×1015 ‐
  • ※1 Heating Rate: 10 °C/min (Tensile)
  • ※2 Heating Rate: 10 °C/min (Comp.)
  • ※3 Measured by SPDR method.
  • ※4 Refer to "Condition Note"PDFを開く
  • ※ Above data are experimental results and not guaranteed.

Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-HS20N ‐ 1.5, 3, 12, 18 µm (LP)
12, 18 µm (HVLP)		 U0.04 0.04 mm
1.5, 3, 12, 18 µm (LP)
12, 18, 35 µm (HVLP)		 M0.06 0.06 mm
0.1 0.10 mm
0.2 0.20 mm
0.41 0.41 mm
(D) 1.5, 3, 12, 18 µm (LP)
12, 18 µm (HVLP)		 U0.04 0.04 mm
1.5, 3, 12, 18 µm (LP)
12, 18, 35 µm (HVLP)		 M0.06 0.06 mm
0.1 0.10 mm
0.2 0.20 mm
0.41 0.41 mm

Note1) LP/HVLP: Low profile copper foil.

Note2) Laminate thicknessmeans  dielectric layer thickness.

Prepreg

Part Number Type Glass cloth Properties
Style Resin content(%) Dielectric Thickness after Lamination ※1 
GH-200 (D) 0.025 (See [GH-200 (Type D)]  ---  page for ultra thin, flat prepregs)
GH-20N ‐ 0.05 (1037N71) 1037 73±2 0.051 mm
0.05 (1037N77) 1037 77±2 0.061 mm
0.06 (1078N63) 1078 63±2 0.072 mm
0.06 (1078N73) 1078 67±2 0.082 mm
0.10 (3313N60) 3313 60±2 0.110 mm
0.10 (3313N63) 3313 63±2 0.121 mm
(D) 0.05 (D1035N69) 1037 69±2 0.051 mm
0.05 (D1035N73) 1037 73±2 0.059 mm
0.06 (D1035N75) 1035 75±2 0.064 mm
0.06 (D1078N65) 1078 65±2 0.072 mm
0.06 (D1078N69) 1078 69±2 0.083 mm
0.10 (D3313N62) 3313 62±2 0.108 mm
0.10 (D3313N65) 3313 65±2 0.118 mm
Reference（IPC-TM-650） 2.3.16 ‐

※1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.            Values change depending on the press condition or inner layer pattern.

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