MCL-HS20N

Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material

About the product

  • Product
    CCL

    MCL-HS20N

    Prepreg

    GH-20N

  • Applications
    • Semiconductor packages (FC-CSP, PoP, SiP)　
    • Thinner Module PWB

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Features

  • MCL-HS20N has hybrid properties of package and high speed materials.
  • MCL-HS20N has low CTE value in X, Y directions and good dielectric property (Dk 3.7, Df 0.0040 at 10GHz).
  • MCL-HS20N(Type D) achieved low dielectric constant (3.4 at 10GHz) and low dissipation factor (0.0025 at 10GHz) using low Dk glass.
  • Well-suited for build-up construction.

Characteristics

Warpage of 4 layer board

Warpage of 4 layer board

TEG Chip
  • Chip size 10 mm×10 mm
  • Chip thickness 100 µm
TEG Substrate
  • Package size 14 mm×14 mm
  • L1, 4: 12 µm Cu: 65%, L2, 3No Copper SR: 18 µm
  • Core thickness: 45 µm
  • Prepreg thickness: 45 µm
 
HS20N 4層基板におけるそり評価結果

Transmission Loss

HS20N伝送損失評価結果

Measurement conditions

  • Evaluation PWB: Strip-line
  • Temperture and Humidity: 25℃/60%RH
  • Characteristic impedance: Approx. 50Ω
  • Proofreading method: TRL(Thru-Reflect-Line)
  • Trace width(w): 0.12–0.14 mm
  • Dielectric thickness(b): 0.65 mm
  • Trace thickness(t): 18 µm
Measurement conditions

Copper Clad Laminate

(t0.2, t0.4mm)

Item Condition ※4 Unit Actual Value Reference
(IPC-TM-650)
MCL-HS20N

MCL-HS20N
(Type D)
Tg TMA method A ℃ 250–270 2.4.24
DMA method A 330–350 ‐
CTE X(30–120℃) A ppm/℃ 8–10 2.4.24.5※1
Y(30–120℃) A 8–10
Z (＜Tg) A 25–35 2.4.24※2
(＞Tg) 140–200
Solder Heat Resistance (260℃) A sec. ≧300 ‐
T-260 (Without copper) A min. ≧60 2.4.24.1
T-288 (Without copper) A ≧60
Decomposition Temperature (TGA method 5% weight loss) A ℃ 410–430 2.3.40
Copper Peel Strength 12 µm A kN/m 0.5–0.7 2.4.8
18 µm A 0.6–0.8
Surface Roughness (Ra) A µm 2–3 2.2.17
Flexural Modulus (Lengthwise) A GPa 21–26 2.4.4
Dielectric Constant※3 10GHz A ‐ 3.6–3.8 3.2–3.4 IEC-62810
Dissipation Factor※3 10GHz A ‐ 0.0035–0.0045 0.0020–0.0030
Volume Resistivity C-96/40/90 Ω･cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance C-96/20/65 Ω 1×1014–1×1016 ‐
C-96/20/65+D-2/100 1×1013–1×1014 ‐
  • ※1 Heating Rate: 10℃/min.(Tensile)
  • ※2 Heating Rate: 10℃/min.(Comp.)
  • ※3 Measured by cavity resonator method.
  • ※4 Refer to "Condition Note"PDFを開く
  • ※ Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-HS20N ‐ 1.5,3,12,18 μm (LP)
12,18 μm (HVLP)		 U0.04 0.04mm
1.5,3,12,18 μm (LP)
12,18,35 μm (HVLP)		 M0.06 0.06mm
0.1 0.10mm
0.2 0.20mm
0.41 0.41mm
(D) 1.5,3,12,18 μm (LP)
12,18 μm (HVLP)		 DU0.04 0.04mm
1.5,3,12,18 μm(LP)
12,18,35 μm (HVLP)		 DM0.06 0.06mm
D0.1 0.10mm
D0.2 0.20mm
D0.41 0.41mm

Note1) LP/HVLP: Low profile copper foil.

Note2) Laminate thicknessmeans  dielectric layer thickness.

Prepreg

Part Number Type Glass cloth Properties
Style Resin content
(%)		 Dielectric Thickness
after Lamination ※1 
GH-200 (D) 0.025 (See [GH-200 (Type D)]  ---  page for ultra thin, flat prepregs)
GH-20N ‐ 0.05 （1037N71） 1037 73±2 0.051 mm
0.05 （1037N77） 1037 77±2 0.061 mm
0.06 （1078N63） 1078 63±2 0.072 mm
0.06 （1078N73） 1078 67±2 0.082 mm
0.10 （3313N60） 3313 60±2 0.110 mm
0.10 （3313N63） 3313 63±2 0.121 mm
（D） 0.05 （D1035N69） 1037 69±2 0.051 mm
0.05 （D1035N73） 1037 73±2 0.059 mm
0.06 （D1035N75） 1035 75±2 0.064 mm
0.06 （D1078N65） 1078 65±2 0.072 mm
0.06 （D1078N69） 1078 69±2 0.083 mm
0.10 （D3313N62） 3313 62±2 0.108 mm
0.10 （D3313N65） 3313 65±2 0.118 mm
Reference（IPC-TM-650） 2.3.16 ‐

※1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.            Values change depending on the press condition or inner layer pattern.

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