MCL-HE-679G (Type S)

Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material

About the product

  • Product
    CCL

    MCL-HE-679G (Type S)

    Prepreg

    GHA-679G (Type S)

  • Applications
    • Network applications
    • High-frequency parts (Filters, VCOs, etc.)

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Features

  • Enables lower transmission loss than MCL-HE-679G with lower dissipation factor.
  • High Tg and superior heat resistance for soldering. (Suitable for lead free process)
  • CTE in Z-direction is 30% lower than that of standard FR-4.
  • Achieved UL 94V-O flammability standard without using any compound which includes halogen, antimony or red phosphorous.

Characteristics

Correlation between Dielectric Constant and Frequency

Correlation between Dielectric Constant and Frequency

Correlation between Dissipation Factor and Frequency

Correlation between Dissipation Factor and Frequency

Transmission Loss

Transmission Loss

Copper Clad Laminate

                                                                                                                                                                                                      (t0.8 mm)

Item Condition ※4 Unit Actual Value Reference
(IPC-TM-650)
MCL-HE-679G (Type S)
Tg TMA method A ℃ 180–190 2.4.24
DMA method A 260–280 ‐
CTE ※1 X (30–120℃) A ppm/℃ 12–15 ‐
Y (30–120℃) A 14–17
Z  (＜Tg) A 30–40 2.4.24
(＞Tg) 190–230
Solder Heat Resistance (260℃) A sec. ≧300 ‐
T-260 (Without Copper) A min. ≧60 2.4.24.1
T-288 (Without Copper) A ≧60
Decomposition Temperature
(TGA method 5% Weight Loss)		 A ℃ 370–390 2.3.40
Copper Peel Strength (RT) 18 µm A kN/m 0.5–0.7 2.4.8
35 µm A 0.6–0.8
Flexural Modulus (Lengthwise) A GPa 23–26 2.4.4
Dielectric Constant 1 GHz ※2 A ‐ 3.7–3.9 JPCA TM-001
10 GHz ※3 A 3.6–3.8
Dissipation Factor 1 GHz ※2 A ‐ 0.006–0.008
10 GHz ※3 A 0.008–0.010
Volume Resistivity C-96/40/90 Ω･cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016 ‐
D-2/100 1×1012–1×1014 ‐
 
  • ※1 Heating Rate: 10℃/min.(Comp.)
  • ※2 Measured by Triplate-line Resonator.
  • ※3Measured by Material Analyzer.
  • ※4Refer to"Condition Note"PDFを開く
  • ※ Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Thickness Code Laminate Thickness
MCL-HE-679G (S) 12 µm
18 µm
35 µm
70 µm		 0.06 0.06 mm
0.08 0.08 mm
0.1 0.10 mm
0.15 0.15 mm
0.2 0.20 mm
0.4 0.40 mm
0.6 0.60 mm
0.8 0.80 mm

Note1) Laminate thickness means dielectric layer thickness.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination ※1 
GHA-679G 0.04 (S1037N72) 1037 72±2 0.053 mm
0.06 (S1080N64) 1080 64±2 0.080 mm
0.06 (S1080N69) 1080 69±2 0.095 mm
0.06 (S1078N64) 1078 64±2 0.078 mm
0.08 (S3313N56) 3313 56±2 0.105 mm
0.08 (S3313N62) 3313 62±2 0.126 mm
0.1 (S2116N54) 2116 54±2 0.128 mm
0.1 (S2116N60) 2116 60±2 0.152 mm
Reference (IPC-TM-650) 2.3.16 ‐

※1) Dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.            Values change depending on the press condition or inner layer pattern.

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