MCL-HE-679G (Type S)
Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material
About the product
- Product
- CCL
-
MCL-HE-679G (Type S)
- Prepreg
-
GHA-679G (Type S)
Inquiry of this product
Applications
- Network applications
- High-frequency parts (Filters, VCOs, etc.)
Benefits
- Enables lower transmission loss than MCL-HE-679G with lower dissipation factor.
- High Tg and superior heat resistance for soldering. (Suitable for lead free process)
- CTE in Z-direction is 30 % lower than that of standard FR-4.
- Achieved UL 94V-0 flammability standard without using any compound which includes halogen, antimony or red phosphorous.
Characteristics
Correlation between Dielectric Constant and Frequency
Correlation between Dissipation Factor and Frequency
Transmission Loss
Measurement conditions
- Evaluation PWB：Micro Strip Line
- Temperature and Humidity： 25℃/60%RH
- Characteristic impedance：Approx. 50Ω
- Calibration method : TRL(Thru-Reflect-Line)
- Trace width (w) : 0.11 mm
- Dielectric thickness(b) : 0.22 mm
- Trace thickness(t) : 18 μm
Copper Clad Laminate
(t0.8 mm)
| Item | Condition ※3 | Unit | Actual Value | Reference (IPC-TM-650) |
||
|---|---|---|---|---|---|---|
| MCL-HE-679G (Type S) | ||||||
| Tg | TMA method | A | °C | 180 - 190 | 2.4.24 | |
| DMA method | A | 260 - 280 | ‐ | |||
| CTE ※1 | X (30 - 120 °C) | A | ppm/°C | 12 - 15 | ‐ | |
| Y (30 - 120 °C) | A | 14 - 17 | ||||
| Z | (<Tg) | A | 30 - 40 | 2.4.24 | ||
| (>Tg) | 190 - 230 | |||||
| Solder Heat Resistance (260 °C) | A | s | ≥300 | ‐ | ||
| T-260 (Without Copper) | A | min | ≥60 | 2.4.24.1 | ||
| T-288 (Without Copper) | A | ≥60 | ||||
| Decomposition Temperature (TGA method 5 % Weight Loss) |
A | °C | 370 - 390 | 2.3.40 | ||
| Copper Peel Strength (RT) | 18 µm | A | kN/m | 0.5 - 0.7 | 2.4.8 | |
| 35 µm | A | 0.6 - 0.8 | ||||
| Flexural Modulus (Lengthwise) | A | GPa | 23 - 26 | 2.4.4 | ||
| Dielectric Constant※2 | 1 GHz | A | ‐ | 3.7 - 3.9 | JPCA TM-001 | |
| 10 GHz | A | 3.6 - 3.8 | ||||
| Dissipation Factor※2 | 1 GHz | A | ‐ | 0.006 - 0.008 | ||
| 10 GHz | A | 0.008 - 0.010 | ||||
| Volume Resistivity | C-96/40/90 | Ω･cm | 1×1014 - 1×1016 | 2.5.17 | ||
| Surface Resistance | C-96/40/90 | Ω | 1×1013 - 1×1015 | |||
| Insulation Resistance | A | Ω | 1×1014 - 1×1016 | ‐ | ||
| D-2/100 | 1×1012 - 1×1014 | ‐ | ||||
- ※1 Heating Rate: 10 °C/min (Comp.)
- ※2 Measured by Triplate-line Resonator.
- ※3Refer to"Condition Note"
- ※ Above data are experimental results and not guaranteed.
Specifications
Copper Clad Laminate
| Part Number | Type | Copper Foil Thickness | Thickness Code | Laminate Thickness |
|---|---|---|---|---|
| MCL-HE-679G | (S) | 12 µm (STD) 18 µm 35 µm 70 µm (RT) |
0.06 | 0.06 mm |
| 0.08 | 0.08 mm | |||
| 0.1 | 0.10 mm | |||
| 0.15 | 0.15 mm | |||
| 0.2 | 0.20 mm | |||
| 0.4 | 0.40 mm | |||
| 0.6 | 0.60 mm | |||
| 0.8 | 0.80 mm |
Note1) Laminate thickness means dielectric layer thickness.
Prepreg
| Part Number | Type | Glass Cloth | Properties | ||
|---|---|---|---|---|---|
| Style | Resin Content (%) | Dielectric Thickness after Lamination ※1 | |||
| GHA-679G | 0.04 | (S1037N72) | 1037 | 72±2 | 0.053 mm |
| 0.06 | (S1080N64) | 1080 | 64±2 | 0.080 mm | |
| 0.06 | (S1080N69) | 1080 | 69±2 | 0.095 mm | |
| 0.06 | (S1078N64) | 1078 | 64±2 | 0.078 mm | |
| 0.08 | (S3313N56) | 3313 | 56±2 | 0.105 mm | |
| 0.08 | (S3313N62) | 3313 | 62±2 | 0.126 mm | |
| 0.1 | (S2116N54) | 2116 | 54±2 | 0.128 mm | |
| 0.1 | (S2116N60) | 2116 | 60±2 | 0.152 mm | |
| Reference (IPC-TM-650) | 2.3.16 | ‐ | |||
※1) Dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0 %. Values change depending on the press condition or inner layer pattern.
Inquiry of this product