MCL-LW-990(Type RFD)

High Tg, Low Transmission Loss Laminate Material

About the product

  • Product 
    CCL

    MCL-LW-990(Type RFD)

    Prepreg

    GWA-990(Type D)

  • Applications
    • High frequency radar/antenna for automotive
    • High frequency devices

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Features

  • Achieved low dielectric constant (Dk) (3.3 at 10 GHz) and low dissipation factor (Df) (0.0020 at 10 GHz) using original resin system and low Dk glass cloth.
  • Improved transmission loss by approximately 30% at 77 GHz compared to our MCL-LW-910G, combined with smooth copper foil.
  • Has excellent heat resistance and connection reliability.

Characteristics

Dielectric Characterization Results (Aging test)

  • Method ： Cavity Resonator
  • Aging condition (Temperature & Humidity) ： 85℃/85%RH 
  • Measurement frequency ： 10 GHz

Transmission Loss

Measurement Conditions
  • Evaluation PWB ： Micro Strip Line 
  • Temperature & Humidity ： 25℃/60%RH 
  • Characteristic impedance ： Approx. 50Ω 
  • Proofreading method : TRL(Thru-Reflect-Line)
  • Trace width (w)：0.3 mm
  • Dielectric thickness (b)：0.127 mm
  • Trace thickness (t1)：30 μm 
  • GND thickness (t2)：30 μm 
Copper foil
  •  MCL-LW-990(Type RFD) ： HVLP
  •  MCL-LW-910G ： HVLP
  •  PTFE ： Standard

Copper Clad Laminate

                                                                                                                                                                                                              (t0.8 mm)

Item Condition※3 Unit Actual Value Reference
(IPC-TM-650)
MCL-LW-990(Type RFD)
Tg TMA method A ℃ 180–230 2.4.24
DMA method A 220–260 ‐
CTE ※1 X (30–120℃) A ppm/℃ 7–10 ‐
Y (30–120℃) 7-10
Z (＜Tg) A 35–55 2.4.24
(＞Tg) A 240–290
Solder Heat Resistance (260 ℃) A sec. ≧300 ‐
T-260 (Without Copper) A min. ≧60 2.4.24.1
T-288 (Without Copper) ≧60
Decomposition Temperature (TGA method 5 % Weight Loss) A ℃ 375–405 2.3.40
Copper Peel Strength 18 µm HVLP A kN/m 0.4–0.6 2.4.8
Flexural Modulus (Lengthwise) A GPa 14–19 2.4.4
 Dielectric Constant 10 GHz ※2 A － 3.1–3.3 IEC-62810
 Dissipation Factor 10 GHz ※2 A － 0.0018–0.0028
Volume Resistivity C-96/40/90 Ω･cm 1×1014–1×1016 2.5.7
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1013–1×1015 ‐
D-2/100 1×1012–1×1014 ‐

※1 Heating Rate: 10℃/min.(Comp.)

※2 Measured by Cavity Resonator.

※3 Refer to"Condition Note"PDFを開く

※ Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Thickness Code Laminate Thickness
MCL-LW-990
 		 (RFD)

12 µm
18 µm
35 µm
(HVLP)

18 µm
35 µm
70 µm
(RTF)

 M0.06 0.06 mm
M0.08 0.08 mm
0.1 0.10 mm
0.13 0.13 mm
0.26 0.25 mm
0.51 0.51 mm

Note1) Laminate thickness means dielectric layer thickness.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination ※1 
GWA-990 0.05 (D1035N74) 1035 74±2 0.064 mm
0.06 (D1078N66) 1078 67±2 0.078 mm
0.06 (D1078N73) 1078 73±2 0.101 mm
0.06 (D1078N75) 1078 75±2 0.112 mm
0.08 (D3313N59) 3313 59±2 0.101 mm
Reference (IPC-TM-650) 2.3.16 ‐

※1  The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%. Values change depending on the press condition or inner layer pattern.

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Solution & Technology