Base Materials
Resonac continues to provide base materials meeting future needs with its broad-ranging material technologies, accommodating demands for thinner electric circuits and next-generation communication standards.
Product List of Base Materials
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Resonac’s copper clad laminates (CCL) and prepregs are ideally suited for high-capacity, high-speed signal transmission in applications such as AI servers, high-speed routers, and 5G/6G communication antennas.
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Resonac’s copper clad laminates (CCL) and prepregs for semiconductor packages support the increasing size of flip chip packages, including 2.xD packages, as well as the thinning of packages such as SiP and AiP.
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