Technical Report (former Hitachi Chemical)
- * Information in the technical reports is current on the date of issue and is subject to change without notice.
No.62／March 2020
Commentary
- Hitachi Chemical Products Contributing to Mobility Business
Review
- Automobile Related Products for Environmental Conservation and Energy Saving
Report
- Primer-less Adhesive for Plastic back door Assembly
- Development of Low Dielectric Constant Polyamide-imide Varnish with High Breakdown Voltage
- Copper-Free Brake Pads with Stable Friction Coefficient
- Reactor Cores and 3D-shaped Motor Cores Manufactured by Powder Metallurgy
- Analysis of Water Consumption Mechanism of Lead Acid Batteries under Idling Stop System Operational Conditions
- Isotropic Conductive Film “IC-01A” for Low Temperature Connection and High Dimensional Stability
- New Low Transmission Loss & Halogen-Free Multi-Layer Material “MCL-LW-990G”
- Low-Melting Vanadate Glass Vaneetect Series VS-1298M
- High Toughness Liquid Crystalline Epoxy Resin
- Study on the Conformability Expression Mechanism of Our Easy Peel-Off Films Using Relaxation Times Measurement and Molecular Dynamics Simulation
No.61／March 2019
Commentary
- Initiative for a Total Solution that Realizes the Customer's Idea and Contributes to the Development of Society
Review
- Action for a Total Solution that Reinforces the Packaging Materials Business
Report
- High Productivity Technology for Semiconductor Process
- High Productive 3D Stacking Process NCF, “AK-400 series”
- Granule-Type Encapsulating Compound for Compression Molding
- Photosensitive Insulation Film, “PV series”
- Dry Film Resists for Fine Line and Space Patterning, “RY-5100UT series”
- Halogen-Free Multilayer Material with Ultra-Low CTE and Low Elastic Modulus, “GEA-775G”
- Copper-Clad Stretchable and Flexible Film
- Sintered, Highly Wear-Resistant Material for Turbochargers
- Resin-Encased, Metallized, Humidity-Resistant Film Capacitor, “MKCP4T”
- Non-fluid Latent Thermal Storage Material
No.60／March 2018
Commentary
- Global Expansion of Energy Business -Understanding the True Needs of Business Partners-
Review
- New Product Development to Support Global Growth of Energy Storage Business
Report
- Demonstration of a Renewable Energy Self-Consumption System for an Apartment in Germany
- Next Generation Wireless Battery Monitoring System (Gen.2)
- New Technology for Industrial Lead Acid Battery
- Development of Automotive Lead Acid Battery for Global Expansion
- Ultra-Low Loss Build-up Film for Fine Pitch Applications, “AS-500HS”
- New Evaluation Technology of EMC to Improve Electrical Reliability of High-Voltage Package
- Thermal Conductive Sheet Containing Vertically Oriented Graphite Fillers “TC-BWP01” for FCBGA TIM1 Applications
- Net Shape Reactor Core Using Newly Developed Insulating-Lubricant
- Transient Liquid Phase Sintering Paste
- Sintering Cu Bonding Paste that can be Sintered without Pressure
No.59／March 2017
Commentary
- Approaches of Open Innovation to Develop Novel Products and Businesses for Global Market Growth
Review
- Open Innovative Activity of Total Solution for Semiconductor Packaging
Report
- Low-Temperature Curable Positive-Tone Photosensitive Dielectric Materials
- Particle-Aligned Anisotropic Conductive Film (PAL-ACF) for Fine Pitch Interconnection
- Low Transmission Loss/Low CTE Multilayer Material, “MCL-HS100”
- Reliability Improvement Technologies for Epoxy Molding Compounds on Lead Frame Package
- Insulating Varnish of Motor for Hybrid Vehicle and Electric Vehicle
- Porous Aluminum for Heat Exchanger
- Hot-melt Adhesive for Automotive Interior
- Copper Free Brake Pads with Stable Friction Coefficient
- Demonstration Project of Power System Stabilization with the Hybrid Battery Energy Storage System
- New Development of High Heat Resistance and Low Dielectric Thermosetting Resin, “S. F. Resin”
- Shock Absorbing Material
- Exosomal mRNA Analysis kit from plasma and urine, “ExoComplete”
- High-density Sintered Sprocket for Silent Chain Made by Die Wall Lubrication Compacting with Liquid Coating
No.58／March 2016
Commentary
- Automotive Components Business of Hitachi Chemical Contributing to Environmental Conservation and Energy Saving
Review
- Automobile Parts for the Environment
Report
- Low Elastic Prepreg for Automotive Application “TD-002”, to Inhibit Solder Crack
- Advanced Analysis of Lead-Acid Batteries
- New Low Transmission Loss Material for Millimeter-wave Rader Module “AS-400HS”
- Highly Thermal Conductive Mica Insulating Tape for Large-Capacity Generator
- Advanced Thermal Insulator Using Inorganic-Organic Hybrid Porous Materials
- Halogen Free and Low Transmission Loss Multilayer Material for Next Generation High Speed Applications: “MCL-LW-900G/910G”
- Reactive Hot Melt Adhesive for Fine Dispensing
- Advanced Analysis of Yellowing Transparent Film
- Cu Paste for Low Temperature Metalization Process
No.57／March 2015
Commentary
- Electrical Energy Storage Business of Hitachi Chemical Contributing to the Secure Social System and Environmental Conservation
Review
- Electrical Energy Storage Devices & Systems
Report
- Lithium-ion Battery System for Smart Grid
- Flooded Type ISS Battery with Improved High Durability and High Charge Acceptance
- Large Format Hybrid Energy Storage System for Power Leveling
- Advanced analysis of LIB and Related Materials
- Reusable Thermal Conductive Sheet Containing Vertically Oriented Graphite Fillers “TC-S01A”
- Wavelength Conversion Particle
- Concept & Situation of Open Laboratory
- Low Dielectric Constant Multilayer Material for Mobile “MCL-E-78G”
- New High Heat Resistant White Molding Compound for LED
- Development of Heat-resisted Polymer for Magnetic Powder Coating
- Silk Fibroin Sponge Sheet for Skin Care
No.56／March 2014
Commentary
- Implementation of material business to materialize infinite possibilities and contribute to society
Review
- CFRP Recycling Technology Using Depolymerization under Ordinary Pressure
Report
- Photosensitive Film for HDI Optimized for DI
- New Material for Fine Patterning Package Substrates by Semi-additive Process "PF-EL"
- Next Generation Molding Compound GE-110 Series for BGA
- Doping Paste for Photovoltaic Solar Cell
- Tear Total IgE Detection Kit
No.55／May 2013
Commentary
- Challenge to Create New Value Based on Uninterrupted Research and Development
Review
- Lithium Ion Battery
- Energy Storage Devices and Systems
- Functional Materials for the Smart Community
- Semiconductor Wafer Process Materials
- Film Technologies for Semiconductor & Electronic Components
- Technology Trends and Future History of Semiconductor Packaging Substrate Material
- Printed Wiring Board Supporting Cloud Computing
- Nanomaterials
- Resin Technology
- Development Trend of Inorganic Materials and Our Developments
- Automotive Parts for “Environment, Safety and Comfort Performance”
- Trends in Environmental and Energy-saving Technology for Automobiles and Corresponding Developments in Powder Metallurgy
- The Business Trend of In-Vitro Diagnostics: MAST CLA and Seratestam
No.54／March 2012
Commentary
- Hitachi Chemical’s R&D Strategy
–Contributing to Society by Developing Superior Technologies and Products to Pioneer a New Era–
Review
- Thermal Management Materials
- Recent Technology of Powder Metallurgy and Applications
Report
- Thermally Conductive Metal Substrate
- Thermally Conductive Flexible Substrate with Heat-resistant Adhesive Layer
- Helical-groove Bearing with Long Life for Fan Motors
- Sintered Heat Resistant Material for Turbochargers
- Photosensitive Solder Resist Film for Semiconductor Package “FZ Series”
- Reliability of Cu Wire Packages and Molding Compounds
- Techniques for Analyzing Underfill Materials for Semiconductor Packages
- Halogen Free, High Elasticity and Low CTE Multilayer Material「MCL-E-700G(R)」
- Anti-Fingerprint UV Curable Hard Coatings
- Application of Layer-by-layer Assembled Nanoparticles to Anti-reflection Film
