Technical Report No.59/March 2017

Full Contents

Commentary

• Approaches of Open Innovation to Develop Novel Products and Businesses for Global Market Growth (PDF format, 174kBytes)

Review

• Open Innovative Activity of Total Solution for Semiconductor Packaging (PDF format, 879kBytes)

Report

• Low-Temperature Curable Positive-Tone Photosensitive Dielectric Materials (PDF format, 158kBytes)
• Particle-Aligned Anisotropic Conductive Film (PAL-ACF) for Fine Pitch Interconnection (PDF format, 289kBytes)
• Low Transmission Loss/Low CTE Multilayer Material, “MCL-HS100” (PDF format, 446kBytes)
• Reliability Improvement Technologies for Epoxy Molding Compounds on Lead Frame Package (PDF format, 313kBytes)
• Insulating Varnish of Motor for Hybrid Vehicle and Electric Vehicle (PDF format, 161kBytes)
• Porous Aluminum for Heat Exchanger (PDF format, 333kBytes)
• Hot-melt Adhesive for Automotive Interior (PDF format, 283kBytes)
• Copper Free Brake Pads with Stable Friction Coefficient (PDF format, 568kBytes)
• Demonstration Project of Power System Stabilization with the Hybrid Battery Energy Storage System (PDF format, 346kBytes)
• New Development of High Heat Resistance and Low Dielectric Thermosetting Resin, “S. F. Resin” (PDF format, 297kBytes)
• Shock Absorbing Material (PDF format, 340kBytes)
• Exosomal mRNA Analysis kit from plasma and urine, “ExoComplete” (PDF format, 250kBytes)
• High-density Sintered Sprocket for Silent Chain Made by Die Wall Lubrication Compacting with Liquid Coating (PDF format, 273kBytes)

Back number

• Technical Report No.62／March 2020
• Technical Report No.61／March 2019
• Technical Report No.60／March 2018
• Technical Report No.59／March 2017
• Technical Report No.58／March 2016
• Technical Report No.57／March 2015
• Technical Report No.56／March 2014
• Technical Report No.55／May 2013
• Technical Report No.54／March 2012