Technical Report No.54/March 2012
Full Contents
Hitachi Chemical Technical Report No.54 (PDF format, 5,089kBytes)

Preface
Review
- Thermal Management Materials (PDF format, 1,095kBytes)
- Recent Technology of Powder Metallurgy and Applications (PDF format, 1,745kBytes)
Report
- Thermally Conductive Metal Substrate (PDF format, 517kBytes)
- Thermally Conductive Flexible Substrate with Heat-resistant Adhesive Layer (PDF format, 598kBytes)
- Helical-groove Bearing with Long Life for Fan Motors (PDF format, 498kBytes)
- Sintered Heat Resistant Material for Turbochargers (PDF format, 502kBytes)
- Photosensitive Solder Resist Film for Semiconductor Package “FZ Series” (PDF format, 638kBytes)
- Reliability of Cu Wire Packages and Molding Compounds (PDF format, 545kBytes)
- Techniques for Analyzing Underfill Materials for Semiconductor Packages (PDF format, 696kBytes)
- Halogen Free, High Elasticity and Low CTE Multilayer Material「MCL-E-700G(R)」 (PDF format, 488kBytes)
- Anti-Fingerprint UV Curable Hard Coatings (PDF format, 536kBytes)
- Application of Layer-by-layer Assembled Nanoparticles to Anti-reflection Film (PDF format, 614kBytes)
Back number
- Technical Report No.62/March 2020
- Technical Report No.61/March 2019
- Technical Report No.60/March 2018
- Technical Report No.59/March 2017
- Technical Report No.58/March 2016
- Technical Report No.57/March 2015
- Technical Report No.56/March 2014
- Technical Report No.55/May 2013
- Technical Report No.54/March 2012