Technical Report No.61/March 2019

Full Contents

Commentary

• Initiative for a Total Solution that Realizes the Customer's Idea and Contributes to the Development of Society (PDF format, 154kBytes)

Review

• Action for a Total Solution that Reinforces the Packaging Materials Business (PDF format, 1,139kBytes)

Report

• High Productivity Technology for Semiconductor Process (PDF format, 648kBytes)
• High Productive 3D Stacking Process NCF, “AK-400 series” (PDF format, 507kBytes)
• Granule-Type Encapsulating Compound for Compression Molding (PDF format, 586kBytes)
• Photosensitive Insulation Film, “PV series” (PDF format, 584kBytes)
• Dry Film Resists for Fine Line and Space Patterning, “RY-5100UT series” (PDF format, 494kBytes)
• Halogen-Free Multilayer Material with Ultra-Low CTE and Low Elastic Modulus, “GEA-775G” (PDF format, 509kBytes)
• Copper-Clad Stretchable and Flexible Film (PDF format, 409kBytes)
• Sintered, Highly Wear-Resistant Material for Turbochargers (PDF format, 537kBytes)
• Resin-Encased, Metallized, Humidity-Resistant Film Capacitor, “MKCP4T” (PDF format, 305kBytes)
• Non-fluid Latent Thermal Storage Material (PDF format, 525kBytes)

Back number

• Technical Report No.62／March 2020
• Technical Report No.61／March 2019
• Technical Report No.60／March 2018
• Technical Report No.59／March 2017
• Technical Report No.58／March 2016
• Technical Report No.57／March 2015
• Technical Report No.56／March 2014
• Technical Report No.55／May 2013
• Technical Report No.54／March 2012