Ultra-low Defect Nano Ceria Slurry
HS-1 Series
About the product
HS-1 series selectively removes SiO2 over other stopper films, making the slurry useful for STI process. Our unique nano ceria abrasive has small particle size with highly reactive surface, enabling ultra-low defect while maintaining high removal rate. Nano ceria abrasive is prepared via liquid-phase synthesis, in contrast to our other ceria slurries.
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Merits
- Very small abrasive minimizing scratches and defects.
- Optimized abrasive size and surface property makes our slurry suitable for the use in STI process
- Combination with our additive allows fine-tuning of polishing selectivity and planarization property.
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