High Removal Rate Ceria Slurry
HS-0 Series
About the product
HS-0 series efficiently removes high step-height oxide pattern, typically used for memory
manufacturing process. These slurries combine our tailor-made abrasive with removal rate accelerator, enabling high removal rate.
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Merits
- Polishes SiO2 films at high removal rate
- Optimized abrasive size and surface property makes our slurry suitable for clearing high step-height pattern.
- High removal rate ensured even at dilute abrasive concentration (<1% CeO2)
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