Oxide-Selective Ceria Slurry
HS-8 Series
About the product
HS-8 series is oxide-selective ceria slurry that enables selective polishing of SiO2 over SiN and/or polycrystalline silicon. The abrasive used in the series is our tailor-made polycrystalline ceria. Under polishing condition, abrasive degrades, continuously exposing fresh, highly-reactive ceria surfaces which effectively removes oxide films.
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Merits
- Effectively polishes SiO2 films
- Optimized abrasive size and surface property makes our slurry suitable for the use in STI process
- Combination with our additive allows fine-tuning of polishing selectivity and planarization property.
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