High-Purity 20% Fluorine/Nitrogen Mixture (F2/N2)
About the product
Resonac’s high-purity gas used for cleaning film deposition chambers in semiconductor manufacturing and chosen mainly for 12-inch CVD equipment.
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Merits
- A stable supply structure supported by a strong supply chain.
- Stable product quality with the technique for packaging corrosive gas.
- Relatively low global warming potential compared with other cleaning gases (GWP value = 0).
- Proven sales track record with semiconductor makers.
- High-quality technical support based on extensive marketing experience
Characteristics
Technical Data
Appearance / colorless or pale yellow gas | Odor / pungent odor |
UN number / 3306 | High-pressure gas, compressed gas, oxidized gas |
Toxic |
- ※ Please refer to the Product Safety Data Sheet (SDS) for the gas’s detailed properties and safety data.
Physical & Chemical Properties of F2/N2
Item | Data |
---|---|
Physical state | Gas |
Appearance | Gas |
Color | Colorless - pale yellow |
Odor | Characteristic pungent odor |
Melting point | Fluorine = -219.61℃ (0.209 kPa) Nitrogen = -209.86℃ (101.3 kPa) |
Boiling point | Fluorine = -188.13℃ (101.3 kPa) Nitrogen = -195.82℃ (101.3 kPa) |
Flash point | Not applicable since fluorine only enhances the combustion of other substances and nitrogen is incombustible. |
Vapor pressure | Fluorine: C.P. -129.0℃, 5.57 MPa Nitrogen: C.P. -147.2℃, 3.394 MPa |
Relative vapor density (20℃) | 1.3392 (calculation value) Fluorine = 1.696 kg/m3 (0 ℃, 101.3 kPa) Nitrogen = 1.2507 kg/m3 (0℃, 101.3 kPa) |
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