High-Purity FC-2316 (C4F6)

About the product

Resonac’s high-purity gas used for etching insulating films in semiconductor manufacturing, and particularly suitable for etching oxide films.

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FC-2316

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Benefits

  • Enables high-aspect-ratio etching.
  • Boasts one of the industry’s largest production volumes and a stable supply structure supported by a strong supply chain.
  • Low global warming potential compared with other etching gases (GWP value ≤1).
  • Proven sales track record with semiconductor makers.
  • High-quality technical support based on extensive marketing experience.

Characteristics

Technical Data

Appearance, odor : colorless odorless gas UN number : 3160
CAS NO. : 685-63-2 Liquefied gas
  • ※ Please refer to the Safety Data Sheet (SDS) for the gas’s detailed properties and safety data.

Physical & Chemical Properties of C4F6

Item Data
Physical state Gas
Appearance Clear and colorless
Color Clear and colorless
pH Not applicable
Melting point -132.1 °C
Boiling point 5.4 °C
Critical temperature 139.6 °C
Autoignition point 490 °C
Vapor pressure 0.178 MPa (20 °C)
0.473 MPa (50 °C)
Relative vapor density (20 °C) 5.6 (air = 1)
Relative density 1.434 (20 °C) / saturation
Explosive limits (upper, lower) (g/m³) Lower limit: 5 vol %
Upper limit: 27 vol % (room temperature, 101.3 kPa, in air)
  • Some data show the gas increases pressure, breaking down into CF4 and C (carbon) without oxygen when 11.7 J energy is applied under pressure of 0.61 MPa and temperature of 60 °C by melt-cutting of nichrome wire.

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