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We in Resonac propose various effective solutions for the problem-solving in manufacturing and technology development.

Solution NEW 77 GHz radar substrate material with excellent RF performance, processability, and reliability Resonac’s LW-990(RFD) features excellent RF performance, processability, and reliability with a low CTE and low elastic modulus resin, meeting 77 GHz radar substrate through precision miniaturization.
Solution Thermal Insulation Coating for preventing energy loss in refrigerant pipes of EVs Resonac’s Thermal Insulation Coating provides excellent heat insulation, low thermal conductivity of 0.03 W/(m･K), and corrosion resistance, making it ideal for insulation of EVs’ refrigerant pipes.
Solution Positive photosensitive insulating resin for FOWLP RDL with high resolution and NMP-free Resonac’s <AR-5100> is a positive photosensitive material for FOWLP RDLs, using a phenol resin for high resolution. <AR-5100> is NMP-free and alkaline developable.
Solution HIMAL prevents delamination of a power semiconductor’s sealing material and improves reliability Used as a sealing material primer, "HIMAL" increases adhesion between the lead frame, semiconductor devices or wires and the sealing material, and reduces internal stress. The reliability of power semiconductors is improved by raising the sealing material’s heat resistance while preventing delamination.
Solution Achieving both low dielectric properties and high adhesion to copper foil!
Primer for millimeter wave circuit substrates Resonac’s primer achieves both low dielectric properties and high adhesion to low-roughness copper foil. Used as an adhesive between substrates and low-roughness copper foil, our SFR reduces transmission loss on the circuit substrates for communication terminals and base stations in 5G communication and other high frequency bands.
Technical Commentary What is ACF (Anisotropic Conductive Film)?
Its usages, how to apply, types, and more are explained. This article explains what ACF stands for, its purposes, how to use, types, and the key points and basic knowledge in choosing the appropriate ACF; it also provides information about RESONAC’s ACF “ANISOLM,” a useful solution to delamination.
Solution High reliability die bonding paste for total cost reduction Die bonding material with low elasticity, excellent stress relaxation, and high adhesive strength. Reliable die bonding can be achieved without additional cost.
Solution High relative permittivity materials for transfer molding It is a high dielectric constant molding material with excellent workability. Due to its low dielectric loss tangent, it exhibits excellent transmission performance even in high frequency bands.
Solution High Thermal Conductive and Moisture Resistance AlN Filler New thermal conductive filler with high thermal conductivity, insulation reliability and moisture resistance.
Solution Solder resists for flexible wiring boards “SN Series” A modified polyimide resin that has both insulation and flexibility. Achieved excellent insulation reliability, detergent resistance, salt water resistance, and low leakage current.
Technical Commentary 【Thorough Commentary】What are transmission loss, dielectric loss, and dielectric loss tangent? This article mainly explains the causes of transmission loss in printed circuit boards, calculation methods, and methods to reduce transmission loss.
Solution A bonding film allowing to construct a PTFE multilayer Adhesive film with excellent adhesion to fluororesin. Low-temperature pressurization at 200°C enables multi-layering of fluororesin substrates.
Solution "SKYVEHEATSINK" realizing miniaturization and weight reduction By reducing fin thickness and pitch to levels difficult to achieve with extruded heatsinks, greater compactness and lighter weight can be achieved without undermining the heat dissipation performance.
Solution Die-bonding paste providing 180 W/(m・k) of thermal conductivity It is a sintered copper bonding paste that has a thermal conductivity of 180 W/(m・K) and can be die-bonded with no pressure or low thermocompression pressure.
Solution Precision 3DP using UV curable monomers "FANCRYL" <500 series> has a bulky DCPD structure that it contributes to low cure shrinkage when added to 3D print resin formulations.
Solution Laminate film cooler "LAMICOOLER" A new cooling device applied the packaging materials of pouch type Li-ion batteries SPALF as materials for the heat exchanger. Resonac can design compact and light-weighted heat exchanger.
Solution A heat-resistant binder resin that conforms to REACH regulations Binder resin that does not use REACH regulated substances. It has the same high heat resistance and mechanical properties as conventional PAI resin.
Solution Stress-absorption prepreg for reducing solder cracks
- Increases reliability of assembled electronic system! It is a sheet (prepreg) made by impregnating glass cloth with resin. It has a low modulus of elasticity and can absorb stress in solder joints and suppress cracks.
Solution Improve the productivity：
Mold cleaning sheets for semiconductor manufacturing processes Resonac's N-CS Series mold cleaning sheets, made of synthetic rubber, efficiently clean molds for semiconductor manufacturing, reducing cleaning time and increasing productivity by removing stains.
Solution Cleaning sheets for rubber molding that remove stains Resonac's QM Series mold cleaning sheets simplify the cleaning process of mold for rubber products, save time, and ensure quality by removing stains and residue without mold disassembly.
Solution Binder for lithium-ion batteries contributing to higher capacity A binder that uses polyamide-imide resin with excellent coating film strength. Contributes to improving the cycle characteristics of lithium-ion batteries.
Solution Aluminum/Plastic Composite Food Containers Almic-Can is a food container made from laminated aluminum foil and resin sheets. This container can thus contribute to solving the issue of food waste and reducing plastic consumption.
Solution Crosslinking agent for preventing degradation of rubber products A cross-linking agent that improves the heat resistance and tensile strength of butyl rubber. Productivity improvement in tire manufacturing can be expected.
Solution Heat resistant coating binder "PNVA" <GE191 Series> Realizes high heat resistant and thin ceramic coating layer for LIB separators, improving safety and energy density of LIBs.
Solution A film capable of bonding a low heat-resistant circuit board It is possible to connect a circuit board with low heat resistance. Because the thickness is several tens of micrometers, it contributes to the thinning of connection parts.

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