QFN Map Molding Support Tape
RT Series
About the product
Resonac’s adhesive tapes are designed to prevent the leakage of resins attached to the backside of lead frames when map molding quad flat non-leaded (QFN) packages. Resonac has marketed these tapes for more than 20 years and holds a large global market share.
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Merits
- Superior wire bonding properties (including Cu wires) due to high Tg, high thermal stability, and low outgassing.
- Superior performance in preventing resin leakage (burrs, mold flashes) during the molding process.
- Low adhesive residue when peeling off the tape.
- Contributes to enhanced productivity with stable wire bonding properties, burr prevention during molding, and low adhesive residue, especially for small package applications such as mini QFN, DFN, and SON.
- Lineup suitability for Cu clip bonding and other high-temperature processes (300-400℃ reflow, etc.).
Characteristics
| Item | Unit | RT-321 | RT-321-KR | RT-300H | RT-300B |
|---|---|---|---|---|---|
| Features | - | Standard product | Standard product (new product) |
High adhesive strength to PPF | Responding to high-temperature processes |
| Bonding temperature | ℃ |
220～250 |
220～250 | 190～250 | 190～250 |
| Detaping temperature※ | ℃ | Room temperature～230 | Room temperature～230 | Room temperature～230 | Room temperature～230 |
| Tg | ℃ | 223 | 223 | 190 | 185 |
| Flash burr after molding | - | None | None | None | None |
| Residue after detaping | - | None | None | None | None |
| Adhesive strength to PPF | N/m | 15 | 30 | 200 | 120 |
- ※ Heating is required for some lead frames and epoxy molding compounds.
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