Reactive Hot Melt Adhesives for Super-fine-pitch Coating
Hi-PURSHOT
About the product
Resonac supplies reactive hot-melt adhesives suitable for ultra-fine dispenser application.
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Applications
- Smartphone, digital camera and other small electric devices' housing and LCD bonding
Features
- Room-temperature curing for shorter takt times
- Chemical reaction with adherend materials and ambient humidity, resulting in excellent heat resistance and adhesion
- Low viscosity enabling super-fine-pitch coating (0.2 mm or above)
- Excellent adhesion to dissimilar materials
- Added waterproofing (sealing) performance
Lineup
| Item | Unit | Hi-PURSHOT 4748W | |
|---|---|---|---|
| Viscosity (120 °C) | mPa·s | Approx. 5,000 | |
| SetTime1) | min | Approx. 3 | |
| Pull Elasticity (23 °C) | MPa | Approx. 80 | |
| Pull Failure Strength (23 °C) | MPa | Approx. 20 | |
| Pull Failure Stretch (23 °C) | % | Approx. 1,000 | |
| Characteristics | - | Impact Resistance, Strong Adhesion | |
| Packaging | - | 30 mL syringe container | |
- 1) 1 mm diameter beads at 23 °C
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