Announcement of the Price Change of Epoxy Molding Compounds for Semiconductors

September 17, 2021

Showa Denko Materials Co., Ltd.

Showa Denko Materials Co., Ltd. (President and CEO: Hisashi Maruyama) announces the decision to raise the selling price of its epoxy molding compounds for semiconductors, effective from October delivery onwards.

The prices of raw materials for epoxy molding compounds, along with logistic costs, have soared in recent years with the rising costs of and surging demand for raw materials.
Despite all-out efforts to maintain product prices through various measures, Showa Denko Materials has faced difficulties to absorb the cost increases and eventually concluded there was no other option but to ask customers to bear a portion of these additional costs.

The products subject to price change and the price increase rate are as follows:

1. Products and price increase rate
   Epoxy molding compounds for semiconductors        Approximate 20%

2. Effective date
   From October 1, 2021 delivery onwards

For further information, contact

Public Relations Group, Brand Communication Department