Fundamental Technologies

Interfacial Adhesion Energy Calculation

Molecular simulation is an advanced technology that reproduces the behavior of molecules and atoms on a computer using physical laws, enabling the prediction of their properties and reactions. In substrate-resin adhesion, it visualizes molecular behavior at the nanoscale and identifies the factors that determine adhesion strength. This enables the efficient development of materials with stronger and more reliable adhesive properties.

Estimation of interfacial adhesion strength and molecular behavior visualization

Materials Informatics

Functional materials are composed of numerous raw materials, and their performance is greatly influenced by the combination of these components. By leveraging AI trained on experimental data, we predict and propose combinations of raw materials that lead to performance improvements. Through iterative cycles of proposal and evaluation, this approach enables the identification of optimal conditions with fewer experiments than conventional methods, accelerating the development of new functional materials.

Optimization technology for raw materials using Bayesian optimization

CAE (Computer Aided Engineering) Analysis

This method involves constructing analytical models based on measurement tests and performing predictive simulations of measurement results. In this case, we simulated temperature changes in semiconductor chips caused by varying levels of delamination in thermal interface materials (TIM) sheet, and quantitatively predicted the impact on semiconductor packages. CAE is also used to verify the mechanisms by examining which physical laws govern the observed phenomena.

CAE modeling for development process and TIM performance prediction

Analysis of Aluminum Alloy Forged Products

Using an atomic-resolution analytical electron microscope, we visualize and evaluate the distribution of each elemental component and additive elements within aluminum alloys.

High-resolution analytical electron microscope and elemental mapping of aluminum alloy

Chemical Composition Mapping Analysis of Lithium-Ion Battery Electrode Surfaces

In lithium-ion battery anodes, artificial graphite powder is mixed with binders and other components and coated onto metal foil. Since binders can contribute to electrical resistance, we analyze the distribution of binder components after coating using Raman spectroscopy, thereby clarifying the correlation between binder distribution and resistance values.

Overlay of Raman mapping and correlation with DC resistance

X-ray CT Observation and 3D Image Analysis Technology for Lithium-Ion Batteries

We create three-dimensional images of lithium-ion battery anode electrode surfaces. By observing the distribution of voids between graphite particles, we identify the ideal structure that allows electrolyte to penetrate quickly, leading to improved electrical characteristics.

3D CT image and analysis of electrolyte pathways

Composition Distribution Analysis of Laminated Substrate Polymers

Using Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS), which detects secondary ions generated from irradiated primary ions and analyzes their mass based on differences in detection time, we visualize the composition distribution of resins used in the insulating layers of substrate materials. This analysis supports the design optimization of polymers for laminated substrates.

Optical microscope image and TOF-SIMS mapping analysis of resin distribution

SPM Analysis of Inorganic Filler Surfaces

We visualize the range of influence exerted by surface treatment agents on nanosized inorganic fillers used in encapsulants for semiconductor packages. Based on these results, we evaluate the effects on resin flowability during molding and the strength and reliability of the molded product.

Visualization of surface treatment layers on fillers by SPM

Evaluation of Heat Dissipation Performance and Reliability in Power Module Structure

We design and prototype evaluation power modules using Resonac materials and assess the performance of materials and components in terms of thermal resistance (heat dissipation) and durability. 

Thermal resistance and durability evaluation of power module materials