Resonac Filed Patent Infringement Lawsuit on Photosensitive Films for Semiconductor Package Substrates and High-density Electronic Circuit Boards
January 24, 2024
Resonac Holdings Corporation
In December 2023, Resonac Corporation (President: Hidehito Takahashi, hereinafter “Resonac”) and Resonac Materials (Dongguan) Co., Ltd. (President: Hiroshi Usami) cooperatively instituted a lawsuit at Shenzhen Intermediate People’s Court against four Chinese companies which manufacture and/or sell photosensitive films, alleging that these four Chinese companies are infringing Resonac’s patent in China on photosensitive films. In this lawsuit, Resonac and Resonac Materials (Dongguan) Co., Ltd. are co-plaintiffs, and Hunan Initial New Materials Co., Ltd., Hunan Hori New Materials Co., Ltd., Shenzhen Sanxi Electronic Circuit Co., Ltd. and Shenzhen Taiwei Precision Circuit Co., Ltd. are co-defendants.
Resonac instituted this lawsuit in order to claim injunction of the sale of photosensitive films which are currently manufactured and/or sold by the four companies in China, and compensation for damages from the sale of those photosensitive films, resting on the basis of Resonac’s patent in China on photosensitive films used for wiring on semiconductor package substrates and/or high-density electronic circuit boards.
Resonac will continue actively utilizing its intellectual properties in accordance with its business strategy and legally protecting intellectual properties, thereby promoting fair competition in the market and increasing the value of its technologies.
For further information, contact
Public Relations Group, Brand Communication Department