Low-soda Alumina
Major Application
Thermally conductive filler materials
About the product
Low-soda alumina AL series is α-alumina which has reduced soda content, controlled by our proprietary technology. The AL series has several ultimate crystal sizes, shapes, and particle size distributions in production. Extra fine alumina particles are used as an ingredient in resins alongside coarse ingredients.
Main Applications
- 1. Filler for heat sink sheet, filler for heat dissipation board (MC board), heat dissipating grease, phase change sheet
- 2. Filler for semiconductor sealing resin
- 3. Silicone-based heat dissipating adhesive, filler for compound
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Related information
【Catalogue】
Associated Information
Properties
White powder
Cautions for storage
Avoid exposure to water.
Packaging
25kg paper bag, 1T bag, etc.
CAS Reg#
CAS1344-28-1
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