High-Purity FC-2316 (C4F6)
About the product
Resonac’s high-purity gas used for etching insulating films in semiconductor manufacturing, and particularly suitable for etching oxide films.
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Merits
- Enables high-aspect-ratio etching.
- Boasts one of the industry’s largest production volumes and a stable supply structure supported by a strong supply chain.
- Low global warming potential compared with other etching gases (GWP value ≦1).
- Proven sales track record with semiconductor makers./li>
- High-quality technical support based on extensive marketing experience.
Characteristics
Technical Data
Appearance, odor / colorless odorless gas | UN number / 3160 |
CAS NO/685-63-2 | Liquefied gas |
- ※ Please refer to the Product Safety Data Sheet (SDS) for the gas’s detailed properties and safety data.
Physical & Chemical Properties of C4F6
Item | Data |
---|---|
Physical state | Gas |
Appearance | Clear and colorless |
Color | Clear and colorless |
pH | Not applicable |
Melting point | -132.1 ℃ |
Boiling point | 5.4 ℃ |
Critical temperature | 139.6 ℃ |
Autoignition point | 490 ℃ |
Vapor pressure |
0.178 MPa(20 ℃) 0.473 MPa(50 ℃) |
Relative vapor density(20 ℃) | 5.6(air = 1) |
Relative density |
1.434 (20 ℃) / saturation |
Explosive limits (upper, lower) (g/m³) |
Lower limit: 5vol % Upper limit: 27 vol% (room temperature, 101.3kPa, in air) Some data show the gas increases pressure, breaking down into CF4 and C (carbon) without oxygen when 11.7J energy is applied under pressure of 0.61MPa and temperature of 60℃ by melt-cutting of nichrome wire. |
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