Photosensitive Solder Resist for Package Substrates
SR7300/SR-F Series
About the product
Resonac’s photosensitive solder resist materials protect and insulate high-density wiring used for semiconductor packages.
Resonac boasts a large market share in the field of semiconductor packages using flip-chip packaging.
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Merits
- Realizes low warpage due to low CTE and low shrinkage.
- Contributes to higher density semiconductor packages due to high resolution.
- Contributes to high reliability (TCT and reflow resistance, etc.) due to high heat resistance.
- Offers the liquid type SR7300 and film type SR-F series.
Characteristics
- ※ Available upon request for film thickness
- Thermal cycle test
- ※ CSAM:Constant-depth mode Scanning Acoustic Microscope
TEST vehicle
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