Photosensitive Materials
Resonac globally offers photosensitive materials developed with its cutting-edge technologies for circuit formation and surface protection of various printed wiring boards, including semiconductor package substrates.
Product List of Photosensitive Materials
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Resonac’s photosensitive solder resist materials protect and insulate high-density wiring used for semiconductor packages.
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Resonac’s photosensitive materials designed to form thick resist pattern layers are used for such applications as the copper plating process of printed wiring boards requiring a high aspect ratio and electroforming in metal mask manufacturing.
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Resonac’s photosensitive resist materials designed to form fine-pitch circuits on semiconductor package substrates can form circuits with a film thickness of 10 um or less and a width of 4 um or less.
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Resonac’s resist materials for forming printed wiring board circuits are applicable to direct-writing exposure machines that pattern circuits using laser beams.
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