Solution
We in Resonac propose various effective solutions for the problem-solving in manufacturing and technology development.
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Solution
Improve flexibility of heat dissipation design for power devices’ embedded substrates
Resonac’s photosensitive interlayer insulation film PV-F enables the formation of large cavities and numerous fine-pitch vias through photolithography.
Semiconductor/Electronic materials
Power semiconductor
Thermal Management
High integration
Miniaturization
Productivity improvement
Heat dissipation properties
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Solution
PCBN extending interrupted cutting tools’ life
with both hardness and fracture resistance Resonac’s PCBN is sintered material with both hardness and fracture resistance. It contributes to extend tool life by reducing occurrence of sudden chipping during lathe machining of stiff objects. Others Industrial use -
Solution
RF Module Substrate with Low Dk, Low Df, and Low CTE, Ideal for Multilayering and Miniaturization
Resonac’s RF module substrate “HS20N (D)” features low Dk, low Df, low CTE, and high Tg. With a lower Dk than conventional models, this can be thinned and multilayered to realize smaller modules.
Semiconductor/Electronic materials
5G
Millimeter wave
High integration
Miniaturization
Low dielectric/High frequency
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Solution
Low-Melting Glass “Vaneetect” Enabling Reliable Hermetic Sealing by Heating at 300°C
Resonac’s low-melting glass contains no substances restricted by the EU’s RoHS Directive and enables sealing at low temperatures, thereby contributing to reduced energy consumption in manufacturing of vacuum insulated glass.
Others
Adhesion/Bonding
Environmentally friendliness
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Solution
Reliability Surpassing Sintered Silver!
Sintered Copper Paste with 300W/m・K Thermal Conductivity
Resonac’s sintered copper paste is suitable for efficient, high-output, miniaturizable SiC modules. It allows better reliability than sintered silver, while having equivalent thermal conductivity.
Semiconductor/Electronic materials
Power semiconductor
xEV
Adhesion/Bonding
Thermal Management
Heat dissipation properties
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Thorough Explanation
【Thorough Explanation】Newest Trends of Next-Gen Semiconductor Packages, Materials, and Substrates
This article describes the increasing density of semiconductor packages due to technologies like IoT, 5G, ADAS, and AI, and discusses the challenges and trends of development of next-gen 3D packages.
Semiconductor/Electronic materials
Power semiconductor
xEV
Thermal Management
Heat dissipation properties
Thermal insulation
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Solution
The Al cooler enabling higher output, downsizing and weight reduction of power modules
Resonac proposes a heatsink/cooler that meets both demand for effective cooling of xEV inverters’ power modules and requirements for reducing their size and weight, according to customer specifications.
Automotive materials
Power semiconductor
xEV
Miniaturization
Weight reduction
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Solution
Enhancing the reliability of power semiconductors!
High Tg, Heat-Resistant Epoxy Molding Compounds Resonac’s heat-resistant epoxy molding compounds feature high Tg, restrain decomposition, prevent delamination, and relax stress, improving reliability test with optimally balanced materials. Semiconductor/Electronic materials Power semiconductor Heat resistance -
Solution
77 GHz radar substrate material with excellent RF performance, processability, and reliability
Resonac’s LW-990(RFD) features excellent RF performance, processability, and reliability with a low CTE and low elastic modulus resin, meeting 77 GHz radar substrate through precision miniaturization.
Automotive materials
Millimeter wave
Sensor
High integration
Miniaturization
Low dielectric/High frequency
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Solution
HIMAL prevents delamination of a power semiconductor’s sealing material and improves reliability
Used as a sealing material primer, "HIMAL" increases adhesion between the lead frame, semiconductor devices or wires and the sealing material, and reduces internal stress. The reliability of power semiconductors is improved by raising the sealing material’s heat resistance while preventing delamination.
Semiconductor/Electronic materials
Power semiconductor
Stress relaxation
Electrical insulation
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Solution
Achieving both low dielectric properties and high adhesion to copper foil!
Primer for millimeter wave circuit substrates Resonac’s primer achieves both low dielectric properties and high adhesion to low-roughness copper foil. Used as an adhesive between substrates and low-roughness copper foil, our SFR reduces transmission loss on the circuit substrates for communication terminals and base stations in 5G communication and other high frequency bands. Semiconductor/Electronic materials 5G Millimeter wave Low dielectric/High frequency -
Thorough Explanation
What is ACF (Anisotropic Conductive Film)?Its usages, how to apply, types, and more are explained.
This article explains what ACF stands for, its purposes, how to use, types, and the key points and basic knowledge in choosing the appropriate ACF; it also provides information about RESONAC’s ACF “ANISOLM,” a useful solution to delamination.
Semiconductor/Electronic materials
High integration
Miniaturization
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Solution
High reliability die bonding paste for total cost reduction
Die bonding material with low elasticity, excellent stress relaxation, and high adhesive strength. Reliable die bonding can be achieved without additional cost.
Semiconductor/Electronic materials
Stress relaxation
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Solution
High relative permittivity materials for transfer molding
It is a high dielectric constant molding material with excellent workability. Due to its low dielectric loss tangent, it exhibits excellent transmission performance even in high frequency bands.
Semiconductor/Electronic materials
5G
Millimeter wave
Miniaturization
Low dielectric/High frequency
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Thorough Explanation
【Thorough Explanation】What are transmission loss, dielectric loss, and dielectric loss tangent?
High-frequency transmission loss is a growing challenge due to increased data via IoT, 5G, ADAS, and AI. This article explains the causes and the reduction methods of transmission loss on PCBs.
Semiconductor/Electronic materials
5G
Low dielectric/High frequency
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Solution
Precision 3DP using UV curable monomers
"FANCRYL" <500 series> has a bulky DCPD structure that it contributes to low cure shrinkage when added to 3D print resin formulations.
Others
Industrial use
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Solution
A heat-resistant binder resin that conforms to REACH regulations
Binder resin that does not use REACH regulated substances. It has the same high heat resistance and mechanical properties as conventional PAI resin.
Automotive materials
Battery material
Environmentally friendliness
Heat resistance
NMP-free
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Solution
Stress-absorption prepreg for reducing solder cracks
- Increases reliability of assembled electronic system!
It is a sheet (prepreg) made by impregnating glass cloth with resin. It has a low modulus of elasticity and can absorb stress in solder joints and suppress cracks.
Semiconductor/Electronic materials
Stress relaxation
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Solution
Improve the productivity：Mold cleaning sheets for semiconductor manufacturing processes
Resonac's N-CS Series mold cleaning sheets, made of synthetic rubber, efficiently clean molds for semiconductor manufacturing, reducing cleaning time and increasing productivity by removing stains.
Semiconductor/Electronic materials
Cleaning
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Solution
Cleaning sheets for rubber molding that remove stains
Resonac's QM Series mold cleaning sheets simplify the cleaning process of mold for rubber products, save time, and ensure quality by removing stains and residue without mold disassembly.
Others
Industrial use
Cleaning
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Solution
Binder for lithium-ion batteries contributing to higher capacity
A binder that uses polyamide-imide resin with excellent coating film strength. Contributes to improving the cycle characteristics of lithium-ion batteries.
Automotive materials
Battery material
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Solution
Crosslinking agent for preventing degradation of rubber products
A cross-linking agent that improves the heat resistance and tensile strength of butyl rubber. Productivity improvement in tire manufacturing can be expected.
Automotive materials
Productivity improvement
Heat resistance
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Solution
Separators’ heat-resistant coating binder that improves LIB safety
Resonac’s PNVA binder demonstrates thermal resistance that satisfies safety requirements of LIBs. The binder also enables a thin ceramic coating on separators, which increases the LIBs’ capacity.
Automotive materials
xEV
Battery material
Heat resistance
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Solution
A film capable of bonding a low heat-resistant circuit board
It is possible to connect a circuit board with low heat resistance. Because the thickness is several tens of micrometers, it contributes to the thinning of connection parts.
Semiconductor/Electronic materials
Miniaturization
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