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We in Resonac propose various effective solutions for the problem-solving in manufacturing and technology development.

Solution Improve flexibility of heat dissipation design for power devices’ embedded substrates Resonac’s photosensitive interlayer insulation film PV-F enables the formation of large cavities and numerous fine-pitch vias through photolithography. Semiconductor/Electronic materials Power semiconductor Thermal Management High integration Miniaturization Productivity improvement Heat dissipation properties
Solution PCBN extending interrupted cutting tools’ life
with both hardness and fracture resistance Resonac’s PCBN is sintered material with both hardness and fracture resistance. It contributes to extend tool life by reducing occurrence of sudden chipping during lathe machining of stiff objects. Others Industrial use
Solution RF Module Substrate with Low Dk, Low Df, and Low CTE,
Ideal for Multilayering and Miniaturization Resonac’s RF module substrate “HS200 (D)” features low Dk, low Df, low CTE, and high Tg. With a lower Dk than conventional models, this can be thinned and multilayered to realize smaller modules. Semiconductor/Electronic materials 5G Millimeter wave High integration Miniaturization Low dielectric/High frequency
Solution Low-Melting Glass “Vaneetect”
Enabling Reliable Hermetic Sealing by Heating at 300°C Resonac’s low-melting glass contains no substances restricted by the EU’s RoHS Directive and enables sealing at low temperatures, thereby contributing to reduced energy consumption in manufacturing of vacuum insulated glass. Others Adhesion/Bonding Environmentally friendliness
Solution Reliability Surpassing Sintered Silver!
Sintered Copper Paste with 300W/m・K Thermal Conductivity Resonac’s sintered copper paste is suitable for efficient, high-output, miniaturizable SiC modules. It allows better reliability than sintered silver, while having equivalent thermal conductivity. Semiconductor/Electronic materials Power semiconductor xEV Adhesion/Bonding Thermal Management Heat dissipation properties
Thorough Explanation 【Thorough Explanation】Newest Trends of Next-Gen Semiconductor Packages, Materials, and Substrates This article describes the increasing density of semiconductor packages due to technologies like IoT, 5G, ADAS, and AI, and discusses the challenges and trends of development of next-gen 3D packages. Semiconductor/Electronic materials Power semiconductor xEV Thermal Management Heat dissipation properties Thermal insulation
Solution The Al cooler enabling higher output, downsizing and weight reduction of power modules Resonac proposes a heatsink/cooler that meets both demand for effective cooling of xEV inverters’ power modules and requirements for reducing their size and weight, according to customer specifications. Automotive materials Power semiconductor xEV Miniaturization Weight reduction
Solution Enhancing the reliability of power semiconductors!
High Tg, Heat-Resistant Epoxy Molding Compounds Resonac’s heat-resistant epoxy molding compounds feature high Tg, restrain decomposition, prevent delamination, and relax stress, improving reliability test with optimally balanced materials. Semiconductor/Electronic materials Power semiconductor Heat resistance
Solution 77 GHz radar substrate material with excellent RF performance, processability, and reliability Resonac’s LW-990(RFD) features excellent RF performance, processability, and reliability with a low CTE and low elastic modulus resin, meeting 77 GHz radar substrate through precision miniaturization. Automotive materials Millimeter wave Sensor High integration Miniaturization Low dielectric/High frequency
Solution Thermal Insulation Coating for preventing energy loss in refrigerant pipes of EVs Resonac’s Thermal Insulation Coating provides excellent heat insulation, low thermal conductivity of 0.03 W/(m･K), and corrosion resistance, making it ideal for insulation of EVs’ refrigerant pipes. Automotive materials xEV Thermal Management Environmentally friendliness Productivity improvement Thermal insulation
Solution Positive photosensitive insulating resin for FOWLP RDL with high resolution and NMP-free Resonac’s <AR-5100> is a positive photosensitive material for FOWLP RDLs, using a phenol resin for high resolution. <AR-5100> is NMP-free and alkaline developable. Semiconductor/Electronic materials High integration Environmentally friendliness NMP-free
Solution HIMAL prevents delamination of a power semiconductor’s sealing material and improves reliability Used as a sealing material primer, "HIMAL" increases adhesion between the lead frame, semiconductor devices or wires and the sealing material, and reduces internal stress. The reliability of power semiconductors is improved by raising the sealing material’s heat resistance while preventing delamination. Semiconductor/Electronic materials Power semiconductor Stress relaxation Electrical insulation
Solution Achieving both low dielectric properties and high adhesion to copper foil!
Primer for millimeter wave circuit substrates Resonac’s primer achieves both low dielectric properties and high adhesion to low-roughness copper foil. Used as an adhesive between substrates and low-roughness copper foil, our SFR reduces transmission loss on the circuit substrates for communication terminals and base stations in 5G communication and other high frequency bands. Semiconductor/Electronic materials 5G Millimeter wave Low dielectric/High frequency
Thorough Explanation What is ACF (Anisotropic Conductive Film)?
Its usages, how to apply, types, and more are explained. This article explains what ACF stands for, its purposes, how to use, types, and the key points and basic knowledge in choosing the appropriate ACF; it also provides information about RESONAC’s ACF “ANISOLM,” a useful solution to delamination. Semiconductor/Electronic materials High integration Miniaturization
Solution High reliability die bonding paste for total cost reduction Die bonding material with low elasticity, excellent stress relaxation, and high adhesive strength. Reliable die bonding can be achieved without additional cost. Semiconductor/Electronic materials Stress relaxation
Solution High relative permittivity materials for transfer molding It is a high dielectric constant molding material with excellent workability. Due to its low dielectric loss tangent, it exhibits excellent transmission performance even in high frequency bands. Semiconductor/Electronic materials 5G Millimeter wave Miniaturization Low dielectric/High frequency
Thorough Explanation 【Thorough Explanation】What are transmission loss, dielectric loss, and dielectric loss tangent? High-frequency transmission loss is a growing challenge due to increased data via IoT, 5G, ADAS, and AI. This article explains the causes and the reduction methods of transmission loss on PCBs. Semiconductor/Electronic materials 5G Low dielectric/High frequency
Solution "SKYVEHEATSINK" realizing miniaturization and weight reduction By reducing fin thickness and pitch to levels difficult to achieve with extruded heatsinks, greater compactness and lighter weight can be achieved without undermining the heat dissipation performance. Semiconductor/Electronic materials 5G Thermal Management Miniaturization Weight reduction
Solution Precision 3DP using UV curable monomers "FANCRYL" <500 series> has a bulky DCPD structure that it contributes to low cure shrinkage when added to 3D print resin formulations. Others Industrial use
Solution A heat-resistant binder resin that conforms to REACH regulations Binder resin that does not use REACH regulated substances. It has the same high heat resistance and mechanical properties as conventional PAI resin. Automotive materials Battery material Environmentally friendliness Heat resistance NMP-free
Solution Stress-absorption prepreg for reducing solder cracks
- Increases reliability of assembled electronic system! It is a sheet (prepreg) made by impregnating glass cloth with resin. It has a low modulus of elasticity and can absorb stress in solder joints and suppress cracks. Semiconductor/Electronic materials Stress relaxation
Solution Improve the productivity：
Mold cleaning sheets for semiconductor manufacturing processes Resonac's N-CS Series mold cleaning sheets, made of synthetic rubber, efficiently clean molds for semiconductor manufacturing, reducing cleaning time and increasing productivity by removing stains. Semiconductor/Electronic materials Cleaning
Solution Cleaning sheets for rubber molding that remove stains Resonac's QM Series mold cleaning sheets simplify the cleaning process of mold for rubber products, save time, and ensure quality by removing stains and residue without mold disassembly. Others Industrial use Cleaning
Solution Binder for lithium-ion batteries contributing to higher capacity A binder that uses polyamide-imide resin with excellent coating film strength. Contributes to improving the cycle characteristics of lithium-ion batteries. Automotive materials Battery material
Solution Aluminum/Plastic Composite Food Containers Contributing to Food Waste Solution and Plastic Reduction "ALMIC-CAN" is a food container made by press-molding a laminated aluminum foil and resin sheet, which provide long-term food preservation and easy opening as well as reduction of plastic. Living Multi-material Environmentally friendliness Designability
Solution Crosslinking agent for preventing degradation of rubber products A cross-linking agent that improves the heat resistance and tensile strength of butyl rubber. Productivity improvement in tire manufacturing can be expected. Automotive materials Productivity improvement Heat resistance
Solution Separators’ heat-resistant coating binder that improves LIB safety Resonac’s PNVA binder demonstrates thermal resistance that satisfies safety requirements of LIBs. The binder also enables a thin ceramic coating on separators, which increases the LIBs’ capacity. Automotive materials xEV Battery material Heat resistance
Solution A film capable of bonding a low heat-resistant circuit board It is possible to connect a circuit board with low heat resistance. Because the thickness is several tens of micrometers, it contributes to the thinning of connection parts. Semiconductor/Electronic materials Miniaturization

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